The Influence of the Application Layer of Pouring Semi-Flexible Pavement Material on Low-Temperature Stress

Pouring semi-flexible pavement material (PSFM) is widely used as a wearing layer material or below pavement due to its excellent resistance to deformation at high temperatures and under heavy loads. However, in cold regions, the material exhibits severe cracking issues. The primary objective of this study is to enhance the resistance of pouring semi-flexible pavements (SFPs) to low-temperature cracking in cold regions by strategically designing pavement structures that incorporate PSFM. To achieve this goal, we conducted indoor tests to determine the relaxation modulus and temperature shrinkage coefficient of PSFM and simulated a pavement structure using COMSOL finite element simulation. The impacts of different application layers and layer thicknesses on low-temperature stresses were investigated based on these findings. The research findings indicate that when PSFM is used as the wearing layer material, the low-temperature stress is 4.7% lower than that of typical materials used in the pavement-wearing layer. When used as the binder layer material, the low-temperature stress on the wearing layer material increases by 3.5%. As the thickness of the wearing layer increases, the low-temperature stress within the pavement structure decreases, but the low-temperature stress on the pavement surface increases. Therefore, it is recommended to use PSFM as the binder layer material and appropriately increase the thickness of the wearing layer to enhance the pavement’s resistance to low-temperature cracking.