Li, B.; Luo, Y.; Li, D.; Li, D.; Yang, B.; Gong, B.; Han, S.; He, S.; Cai, M.
High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere. Processes 2025, 13, 1042.
https://doi.org/10.3390/pr13041042
AMA Style
Li B, Luo Y, Li D, Li D, Yang B, Gong B, Han S, He S, Cai M.
High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere. Processes. 2025; 13(4):1042.
https://doi.org/10.3390/pr13041042
Chicago/Turabian Style
Li, Bofu, Yinyin Luo, Dejian Li, Dameng Li, Baobin Yang, Baoliang Gong, Shunfeng Han, Siliang He, and Miao Cai.
2025. "High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere" Processes 13, no. 4: 1042.
https://doi.org/10.3390/pr13041042
APA Style
Li, B., Luo, Y., Li, D., Li, D., Yang, B., Gong, B., Han, S., He, S., & Cai, M.
(2025). High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere. Processes, 13(4), 1042.
https://doi.org/10.3390/pr13041042
