Yulianto, N.; Bornemann, S.; Daul, L.; Margenfeld, C.; Clavero, I.M.; Majid, N.; Koenders, L.; Daum, W.; Waag, A.; Wasisto, H.S.
Transferable Substrateless GaN LED Chips Produced by Femtosecond Laser Lift-Off for Flexible Sensor Applications. Proceedings 2018, 2, 891.
https://doi.org/10.3390/proceedings2130891
AMA Style
Yulianto N, Bornemann S, Daul L, Margenfeld C, Clavero IM, Majid N, Koenders L, Daum W, Waag A, Wasisto HS.
Transferable Substrateless GaN LED Chips Produced by Femtosecond Laser Lift-Off for Flexible Sensor Applications. Proceedings. 2018; 2(13):891.
https://doi.org/10.3390/proceedings2130891
Chicago/Turabian Style
Yulianto, Nursidik, Steffen Bornemann, Lars Daul, Christoph Margenfeld, Irene Manglano Clavero, Nurhalis Majid, Ludger Koenders, Winfried Daum, Andreas Waag, and Hutomo Suryo Wasisto.
2018. "Transferable Substrateless GaN LED Chips Produced by Femtosecond Laser Lift-Off for Flexible Sensor Applications" Proceedings 2, no. 13: 891.
https://doi.org/10.3390/proceedings2130891
APA Style
Yulianto, N., Bornemann, S., Daul, L., Margenfeld, C., Clavero, I. M., Majid, N., Koenders, L., Daum, W., Waag, A., & Wasisto, H. S.
(2018). Transferable Substrateless GaN LED Chips Produced by Femtosecond Laser Lift-Off for Flexible Sensor Applications. Proceedings, 2(13), 891.
https://doi.org/10.3390/proceedings2130891
