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Article

Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling

1
Department of Mechanical and Intelligent System Engineering, The University of Electro-Communications, 1-5-1 Chofugaoka, Tokyo 182-8585, Japan
2
Department of Mechanical Engineering, Saga University, 1 Honjo–Machi, Saga 840-8502, Japan
3
Japan Aerospace Exploration Agency, 3-1-1 Yoshinodai, Sagamihara, Kanagawa 252-5210, Japan
4
Central Research Institute, Mitsubishi Materials Co., Ltd., 1-600 Kitabukurocho, Omiya, Saitama 330-0835, Japan
*
Authors to whom correspondence should be addressed.
Appl. Mech. 2023, 4(1), 20-30; https://doi.org/10.3390/applmech4010002
Submission received: 30 November 2022 / Revised: 21 December 2022 / Accepted: 26 December 2022 / Published: 4 January 2023
(This article belongs to the Special Issue Applied Thermodynamics: Modern Developments (2nd Volume))

Abstract

Water–copper is one of the most common combinations of working fluid and heating surface in high-performance cooling systems. Copper is usually selected for its high thermal conductivity and water for its high heat transfer coefficient, especially in the two-phase regime. However, copper tends to suffer oxidation in the presence of water and thus the heat flux performance is affected. In this research, an experimental investigation was conducted using a cooper bare surface as a heating surface under a constant mass flux of 600 kg·m2·s1 of deionized water at a subcooled inlet temperature ΔTsub of 70 K under atmospheric pressure conditions on a closed-loop. To confirm the heat transfer deterioration, the experiment was repeated thirteen times. On the flow boiling region after thirteen experiments, the results show an increase in the wall superheat ΔTsat of approximately 26% and a reduction in the heat flux of approximately 200 kW·m2. On the other hand, the effect of oxidation on the single phase is almost marginal.
Keywords: subcooled flow boiling; copper oxidation; heat flux; two-phase flow; single-phase flow subcooled flow boiling; copper oxidation; heat flux; two-phase flow; single-phase flow

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MDPI and ACS Style

Santiago Galicia, E.; Kinjo, T.; Som Onn, O.; Saiwai, T.; Takita, K.; Orito, K.; Enoki, K. Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling. Appl. Mech. 2023, 4, 20-30. https://doi.org/10.3390/applmech4010002

AMA Style

Santiago Galicia E, Kinjo T, Som Onn O, Saiwai T, Takita K, Orito K, Enoki K. Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling. Applied Mechanics. 2023; 4(1):20-30. https://doi.org/10.3390/applmech4010002

Chicago/Turabian Style

Santiago Galicia, Edgar, Tomihiro Kinjo, Ouch Som Onn, Toshihiko Saiwai, Kenji Takita, Kenji Orito, and Koji Enoki. 2023. "Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling" Applied Mechanics 4, no. 1: 20-30. https://doi.org/10.3390/applmech4010002

APA Style

Santiago Galicia, E., Kinjo, T., Som Onn, O., Saiwai, T., Takita, K., Orito, K., & Enoki, K. (2023). Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling. Applied Mechanics, 4(1), 20-30. https://doi.org/10.3390/applmech4010002

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