Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling
Abstract
Share and Cite
Santiago Galicia, E.; Kinjo, T.; Som Onn, O.; Saiwai, T.; Takita, K.; Orito, K.; Enoki, K. Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling. Appl. Mech. 2023, 4, 20-30. https://doi.org/10.3390/applmech4010002
Santiago Galicia E, Kinjo T, Som Onn O, Saiwai T, Takita K, Orito K, Enoki K. Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling. Applied Mechanics. 2023; 4(1):20-30. https://doi.org/10.3390/applmech4010002
Chicago/Turabian StyleSantiago Galicia, Edgar, Tomihiro Kinjo, Ouch Som Onn, Toshihiko Saiwai, Kenji Takita, Kenji Orito, and Koji Enoki. 2023. "Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling" Applied Mechanics 4, no. 1: 20-30. https://doi.org/10.3390/applmech4010002
APA StyleSantiago Galicia, E., Kinjo, T., Som Onn, O., Saiwai, T., Takita, K., Orito, K., & Enoki, K. (2023). Heat Transfer Deterioration by the Copper Oxide Layer on Horizontal Subcooled Flow Boiling. Applied Mechanics, 4(1), 20-30. https://doi.org/10.3390/applmech4010002