MEMS Transducers: Fabrication, Performance and Applications
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: 20 November 2025
Special Issue Editors
Interests: actuators; CMOS-MEMS integration; heterogeneous integration; MEMS; microfabrication; piezoelectric; sensors; transducers; ultrasonic transducers
Interests: microelectromechanical systems (MEMS); micromechanical resonators; micromechanical sensors; piezoelectric devices
Special Issues, Collections and Topics in MDPI journals
Interests: MEMS; piezoelectric actuators and sensors; optical MEMS
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Microelectromechanical system (MEMS) transducers are at the forefront of innovation, enabling compact, high-performance sensing and actuation solutions across diverse fields such as healthcare, environmental monitoring, communications, and automation. This Special Edition of Applied Sciences, titled "MEMS Transducers: Fabrication, Performance and Applications", aims to showcase the latest advancements and interdisciplinary research in the design, fabrication, integration, and deployment of MEMS-based transducers.
We welcome original research articles, reviews, and case studies that address all aspects of MEMS transducers, from fundamental fabrication technologies—such as lithography, etching, micromachining, and thin film deposition—to advanced integration strategies including CMOS-MEMS and heterogeneous integration. Submissions focusing on materials (e.g., piezoelectrics), characterization techniques, and system-level packaging are also encouraged.
In addition to fabrication and performance optimization, this Special Edition seeks contributions that explore the expanding application space of MEMS transducers, including their roles in BioMEMS, ultrasound and optical systems, RF and smart transducers, and their integration into emerging paradigms such as the Internet of Things (IoT), Artificial Intelligence of Things (AIoT), digital twins, and sensor networks.
By bringing together cutting-edge research and real-world applications, this edition aims to highlight the critical role MEMS transducers play in enabling next-generation intelligent and interconnected systems.
Dr. Daniel Ssu Han Chen
Dr. Joshua En-Yuan Lee
Dr. Aron Michael
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- actuators
- Artificial Intelligence of Things (AIoT)
- BioMEMS
- characterization
- digital twin
- etching
- Internet of Things (IoT)
- lithography
- microelectromechanical systems (MEMS)
- microfabrication
- micromachining
- nanoelectromechanical systems (MEMS)
- optical MEMS
- packaging and integration
- piezoelectric
- RF MEMS
- sensor networks
- sensors
- smart transducers
- thin film deposition
- transducers
- ultrasound transducers
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