Future Information & Communication Engineering 2025
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".
Deadline for manuscript submissions: 30 June 2026 | Viewed by 2105
Special Issue Editors
Interests: compact modeling for circuit simulation; device modeling for TCAD simulation; device characterization; steep-switching device; GAA NW-FET; 2D material transistor; neuromorphic device
Special Issues, Collections and Topics in MDPI journals
Interests: security in network; convergence and operating system
Special Issues, Collections and Topics in MDPI journals
Interests: AI; big data; virtualization; shipbuilding industry; shipping industry; Industry 4.0
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue will comprise selected papers from The 17th International Conference on Future Information & Communication Engineering (ICFICE 2025), which was held at the Hotel Nikko Guam, USA on 1st–4th July 2025.
Following ICFICE 2025, we will organize a Special Issue, soliciting original research papers on all of the technical aspects of computer science, information, and communication engineering. Potential topics include, but are not limited to, the following:
- Communication systems and applications;
- Networking and services;
- AI and intelligent information systems;
- Multimedia and digital convergence;
- Semiconductor and communication services;
- Biomedical imaging and engineering;
- Ubiquitous sensor networks;
- Database and internet applications;
- IoT and Big Data;
- IT convergence technology.
Prof. Dr. Yun Seop Yu
Prof. Dr. Daesung Lee
Prof. Dr. Jun-Ho Huh
Guest Editors
Dr. Dae-hwan Kim
Guest Editor Assistant
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- communication systems
- networking
- smart security
- intelligent information systems
- artificial intelligence
- machine learning
- biomedical imaging
- multimedia and digital convergence
- semiconductors
- ubiquitous sensor networks
- database
- internet application
- big data
- Internet of Things (IoT)
- Information Technology (IT) convergence
- Augmented Reality (AR)/Virtual Reality (VR)
- metaverse
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