Multiscale Heat and Mass Transfer and Artificial Intelligence

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Thermal Engineering".

Deadline for manuscript submissions: 10 November 2024 | Viewed by 122

Special Issue Editors


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Guest Editor
School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, China
Interests: heat transfer; complex fluid; AI for thermal management; active cooling techniques

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Guest Editor
School of Construction Management and Engineering, University of Reading, Reading RG6 6AH, UK
Interests: smart cities; built environment; low-carbon energy systems; sustainable mobility; intelligent computing
School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, China
Interests: multi-scale coupling simulation (reactive molecular dynamics, pore-network modelling, lattice Boltzmann method, computational fluid dynamics)

Special Issue Information

Dear Colleagues, 

Heat and mass transfer is an important research area that is relevant to a variety of emerging technologies in the fields of energy, low-carbon energy utilization, chemical engineering and aerospace engineering, etc. Multiscale simulation techniques and complement experimental studies from atomic to macroscopic scale brought about numerous breakthroughs. Recently, cutting-edge artificial intelligence (AI) technologies have emerged as powerful tools to accelerate fundamental physics-based understanding and applications in heat and mass transfer research. In view of these achievements, this Special Issue is devoted to showcasing cutting-edge research and developments in the field of multiscale heat and mass transfer and AI technologies. This Special Issue will cover a broad spectrum of topics, including but not limited to:

  • Flow and temperature field reconstruction technology;
  • Machine learning and AI in thermal management;
  • Multiscale simulation techniques in heat and mass transfer characteristics;
  • Physics-informed neural networks (PINNs) for heat-transfer problems;
  • Advanced measurement and experimental techniques;
  • Micro/nano-scale thermos-fluidics;
  • Heat and mass transfer under extreme conditions;
  • Multidisciplinary research on thermal energy conversion and heat transfer.

Dr. Guice Yao
Dr. Chuang Wen
Dr. Jin Zhao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • machine learning
  • heat transfer
  • multiscale modelling
  • multidisciplinary energy conversion
  • temperature reconstruction
  • flow dynamics
  • physics-informed neural network

Published Papers

This special issue is now open for submission.
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