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Applied Sciences
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Printed Electronics Processing
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Printed Electronics Processing

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".

Deadline for manuscript submissions: closed (30 June 2021) | Viewed by 8533

Special Issue Editors

Dr. Eloi Ramon

E-Mail Website
Guest Editor
Institute of Microelectronics of Barcelona IMB-CNM (CSIC), Campus Universitat Autònoma de Barcelona, 08193 Cerdanyola del Vallès, Barcelona, Catalonia, Spain
Interests: printed electronics; flexible electronics; organic Thin Film Transistors (OTFTs); inkjet printing; additive manufacturing; sustainable electronics; printed sensors; funcional electronic materials
Dr. Jordi Carrabina

E-Mail Website
Guest Editor
Universitat Autònoma de Barcelona, Barcelona, Spain

Special Issue Information

Dear Colleagues,

Printed, organic, and/or flexible electronics commonly known as printed electronics aim to complement the manufacture of conventional electronics (either silicon or PCB) with new printing concepts and contribute to the next electronic revolution. The related manufacturing processes are generally of low material waste and low energy consumption. They take advantage of all the characteristics of solvent-based materials to prepare stacks of structured electrical layers in a much simpler and cost-effective way. The development of devices and circuits based on these processes opens the door to disposable, flexible, and low-cost systems.

We are launching a Special Issue of the journal Applied Sciences entitled “Printed Electronics Processing”. This issue will cover the various experimental and theoretical aspects related to printed electronics processing and its applications. This Special Issue will publish innovative research articles related to flexible electronic materials, printing techniques, additive manufacturing, and components or systems that meet any of the above criteria.

This Special Issue aims to encourage and publish research on the challenges and opportunities associated with developing high-throughput, low-cost manufacturing methods for electronic applications. The topics listed below indicate the range of work that is relevant to the issue:

  • Printable materials for the implementation of conductors, semiconductors, dielectrics, and sensors;
  • New printing processes and technologies;
  • Large-area and/or high-volume deposition and patterning techniques;
  • Process variability, reliability, and yield;
  • Devices and systems facing new applications.

Dr. Eloi Ramon
Dr. Jordi Carrabina
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • printed electronics
  • printing technologies
  • printing processes
  • additive manufacturing
  • solvent-based materials
  • functional inks
  • flexible displays
  • printed flexible sensors
  • hybrid electronics

Published Papers (3 papers)

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Research

12 pages, 1673 KiB  
Article
Programmable Organic Chipless RFID Tags Inkjet Printed on Paper Substrates
by Miquel Moras, Carme Martínez-Domingo, Roger Escudé, Cristian Herrojo, Ferran Paredes, Lluís Terés, Ferran Martín and Eloi Ramon
Appl. Sci. 2021, 11(17), 7832; https://doi.org/10.3390/app11177832 - 25 Aug 2021
Cited by 16 | Viewed by 2514
Abstract
In this paper, an organic, fully recyclable and eco-friendly 20-bit inkjet-printed chipless RFID tag is presented. The tag operates in the near field and is implemented by means of chains of resonant elements. The characterization and manufacturing process of the tag, printed with [...] Read more.
In this paper, an organic, fully recyclable and eco-friendly 20-bit inkjet-printed chipless RFID tag is presented. The tag operates in the near field and is implemented by means of chains of resonant elements. The characterization and manufacturing process of the tag, printed with a few layers of a commercial organic ink on conventional paper substrate (DIN A4), are presented, and tag functionality is demonstrated by reading it by means of a custom-designed reader. The tags are read by proximity (through the near field), by displacing them over a resonator-loaded transmission line, and each resonant element (bit) of the tag is interrogated by a harmonic signal tuned to the resonance frequency. The coupling between the reader line and the resonant elements of the tag produce and amplitude modulated (AM) signal containing the identification (ID) code of the tag. Full article
(This article belongs to the Special Issue Printed Electronics Processing)
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10 pages, 4674 KiB  
Article
Development of 3D-Printed MWCNTs/AC/BNNTs Ternary Composite Electrode Material with High-Capacitance Performance
by Asrar Alam, Ghuzanfar Saeed, Seong Min Hong and Sooman Lim
Appl. Sci. 2021, 11(6), 2636; https://doi.org/10.3390/app11062636 - 16 Mar 2021
Cited by 14 | Viewed by 2366
Abstract
Activated carbon (AC) and multiwalled carbon nanotubes (MWCNTs) have been extensively investigated in recent decades as electrical double-layer capacitor (EDLC) electrode materials for supercapacitors, owing to their superior capacitive properties and cycling stability performance. However, in the modern electronics industry, ternary electrode materials [...] Read more.
Activated carbon (AC) and multiwalled carbon nanotubes (MWCNTs) have been extensively investigated in recent decades as electrical double-layer capacitor (EDLC) electrode materials for supercapacitors, owing to their superior capacitive properties and cycling stability performance. However, in the modern electronics industry, ternary electrode materials have been designed to develop high-performance and efficient energy storage devices. EDLC-based ternary materials are of great importance, where all the present components participate both individually and as a multicomponent electrode system to promote high-electrochemical performance electrode materials. In this study, we have incorporated an optimized content of boron nitride nanotube (BNNT) powder into a binary material composed of AC and MWCNTs to enhance their electrochemical performance using a pneumatic printer. The printed MWCNTs/AC/BNNTs ternary composite electrode material has shown a maximum specific capacitance of 262 F g−1 at a minimum current density of 1 A g−1, with a capacitance retention of 49.61% at a maximum current density of 10 A g−1. These results demonstrate that the printable MWCNTs/AC/BNNTs ternary composite electrode material is a potential candidate for the development of high-performance supercapacitors. Full article
(This article belongs to the Special Issue Printed Electronics Processing)
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12 pages, 2129 KiB  
Article
All-Organic, Low Voltage, Transparent and Compliant Organic Field-Effect Transistor Fabricated by Means of Large-Area, Cost-Effective Techniques
by Stefano Lai, Giulia Casula, Pier Carlo Ricci, Piero Cosseddu and Annalisa Bonfiglio
Appl. Sci. 2020, 10(19), 6656; https://doi.org/10.3390/app10196656 - 23 Sep 2020
Cited by 12 | Viewed by 3018
Abstract
The development of electronic devices with enhanced properties of transparency and conformability is of high interest for the development of novel applications in the field of bioelectronics and biomedical sensing. Here, a fabrication process for all organic Organic Field-Effect Transistors (OFETs) by means [...] Read more.
The development of electronic devices with enhanced properties of transparency and conformability is of high interest for the development of novel applications in the field of bioelectronics and biomedical sensing. Here, a fabrication process for all organic Organic Field-Effect Transistors (OFETs) by means of large-area, cost-effective techniques such as inkjet printing and chemical vapor deposition is reported. The fabricated device can operate at low voltages (as high as 4 V) with ideal electronic characteristics, including low threshold voltage, relatively high mobility and low subthreshold voltages. The employment of organic materials such as Parylene C, PEDOT:PSS and 6,13-Bis(triisopropylsilylethynyl)pentacene (TIPS pentacene) helps to obtain highly transparent transistors, with a relative transmittance exceeding 80%. Interestingly enough, the proposed process can be reliably employed for OFET fabrication over different kind of substrates, ranging from transparent, flexible but relatively thick polyethylene terephthalate (PET) substrates to transparent, 700-nm-thick, compliant Parylene C films. OFETs fabricated on such sub-micrometrical substrates maintain their functionality after being transferred onto complex surfaces, such as human skin and wearable items. To this aim, the electrical and electromechanical stability of proposed devices will be discussed. Full article
(This article belongs to the Special Issue Printed Electronics Processing)
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