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Electronics
Special Issues
3D Computer Vision and 3D Reconstruction
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3D Computer Vision and 3D Reconstruction

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 31 March 2025 | Viewed by 674

Special Issue Editors

Dr. Yilong Li

E-Mail Website
Guest Editor
School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing 100191, China
Interests: 3D display; holographic display
Dr. Di Wang

E-Mail Website
Guest Editor
School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing 100191, China
Interests: 3D display; holographic display; near-eye display
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Huan Deng

E-Mail Website
Guest Editor
College of Electronics and Information Engineering, Sichuan University, Chengdu 610065, China
Interests: 3D display; integral imaging
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The Special Issue aims to explore the latest advancements and innovations in the field of 3D computer vision and 3D reconstruction techniques. With the recent rapid development in computer science, electronic devices, optics, and related fields, 3D computer vision and reconstruction have hit their stride in recent years. These technologies inject new vitality into fields such as intelligent manufacturing, AR/VR display, and so on. Currently, there are substantial research-and-development efforts being made by academia and industry in this field. Accordingly, this Special Issue seeks to showcase research papers, communications, and review articles that focus on (1) 3D information acquisition and processing; (2) 3D reconstruction methods; (3) computer vision; (4) deep learning for 3D systems; and (5) emerging optical materials for 3D reconstruction.

  1. 3D information acquisition and processing;
  2. 3D reconstruction methods;
  3. Computer vision;
  4. Deep learning for 3D systems;
  5. Emerging optical materials for 3D reconstruction.

Dr. Yilong Li
Dr. Di Wang
Prof. Dr. Huan Deng
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D information acquisition and processing
  • 3D reconstruction methods
  • computer vision
  • deep learning for 3D systems
  • emerging optical materials for 3D reconstruction

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Published Papers (1 paper)

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Research

14 pages, 3852 KiB  
Article
Implementation of an FPGA-Based 3D Shape Measurement System Using High-Level Synthesis
by Tae-Hyeon Kim, Hyunki Lee and Seung-Ho Ok
Electronics 2024, 13(16), 3282; https://doi.org/10.3390/electronics13163282 - 19 Aug 2024
Viewed by 401
Abstract
Three-dimensional(3D) shape measurement using point clouds has recently gained significant attention. Phase measuring profilometry (PMP) is widely preferred for its robustness against external lighting changes and high-precision results. However, PMP suffers from long computation times due to complex calculations and its high memory [...] Read more.
Three-dimensional(3D) shape measurement using point clouds has recently gained significant attention. Phase measuring profilometry (PMP) is widely preferred for its robustness against external lighting changes and high-precision results. However, PMP suffers from long computation times due to complex calculations and its high memory usage. It also faces a 2π ambiguity issue, as the measured phase is limited to the 2π range. This is typically resolved using dual-wavelength methods. However, these methods require separate measurements of phase changes at two wavelengths, increasing the data processing volume and computation times. Our study addresses these challenges by implementing a 3D shape measurement system on a System-on-Chip (SoC)-type Field-Programmable Gate Array (FPGA). We developed a PMP algorithm with dual-wavelength methods, accelerating it through high-level synthesis (HLS) on the FPGA. This hardware implementation significantly reduces computation time while maintaining measurement accuracy. The experimental results demonstrate that our system operates correctly on the SoC-type FPGA, achieving computation speeds approximately 11.55 times higher than those of conventional software implementations. Our approach offers a practical solution for real-time 3D shape measurement, potentially benefiting applications in fields such as quality control, robotics, and computer vision. Full article
(This article belongs to the Special Issue 3D Computer Vision and 3D Reconstruction)
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