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Advances in the Modeling and Simulation of Technical Systems Using...
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Advances in the Modeling and Simulation of Technical Systems Using Modelica

A special issue of Electronics (ISSN 2079-9292).

Deadline for manuscript submissions: closed (15 January 2024) | Viewed by 2352

Special Issue Editors

Prof. Dr. Dirk Műller

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Guest Editor
Institute for Energy Efficient Buildings and Indoor Climate, RWTH Aachen University, Mathieustrasse 10, 52074 Aachen, Germany
Interests: building energy systems; urban energy systems; digitalization of energy systems; optimization of energy systems
Dr. Dominik Hering

E-Mail Website
Guest Editor
Institute for Energy Efficient Buildings and Indoor Climate, RWTH Aachen University, Mathieustrasse 10, 52074 Aachen, Germany
Interests: building energy systems; urban energy systems; digitalisation of energy systems; optimisation of energy systems
Prof. Dr. Antonello Monti

E-Mail Website
Guest Editor
E.ON Energy Research Center, RWTH Aachen University, 52074 Aachen, Germany
Interests: power system dynamics, grid automation; real-time simulation; cloud applications for energy
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Andrea Benigni

E-Mail Website
Guest Editor
Institut für Energie- und Klimaforschung (IEK), Energiesystemtechnik (IEK-10), Forschungszentrum Jülich, Wilhelm-Johnen-Straße, 52428 Jülich, Germany
Interests: power systems simulation; power electronics; renewable energy engineering; distributed generation

Special Issue Information

Dear Colleagues,

The Modelica Conference 2023, which will take place in Aachen (Germany), is an event for users, library developers, tool vendors and language designers to share their knowledge and learn about the latest scientific and industrial progress related to Modelica, FMI, SSP and DCP. The program will cover the modeling of complex physical and cyber-physical systems and tools for a wide range of research and industrial applications.
In addition to paper presentations, the conference will feature several Modelica tutorials for beginners and advanced users, as well as industrial user presentations, vendor sessions and an exhibition of the conference’s sponsors. The previous Modelica conference was hosted in 2021 as an online conference by Linköping University, Sweden. The previous in-person Modelica conference took place in 2019 in Regensburg, Germany, and was attended by more than 400 participants from all over the world. We look forward welcoming participants to this year’s conference in Aachen, following which the proceedings will be published and the best papers will be presented in this Special Issue: Advances in the Modeling and Simulation of Technical Systems Using Modelica.

Prof. Dr. Dirk Műller
Dr. Dominik Hering
Prof. Dr. Antonello Monti
Prof. Dr. Andrea Benigni
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • automotive applications
  • thermodynamic and energy systems applications
  • mechatronics and robotics applications

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Published Papers (2 papers)

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Research

27 pages, 1214 KiB  
Article
Heat Consumer Model for Robust and Fast Simulations of District Heating Networks Using Modelica
by Johannes Zipplies, Janybek Orozaliev, Ulrike Jordan and Klaus Vajen
Electronics 2024, 13(7), 1201; https://doi.org/10.3390/electronics13071201 - 25 Mar 2024
Viewed by 802
Abstract
Dynamic thermo-hydraulic simulations of district heating networks (DHN) are essential to investigate novel concepts for their sustainable design and operation. To develop solutions for a particular case study, numerous long-term simulations are required. Therefore, computational effort for simulation is critical. Heat consumers (HC) [...] Read more.
Dynamic thermo-hydraulic simulations of district heating networks (DHN) are essential to investigate novel concepts for their sustainable design and operation. To develop solutions for a particular case study, numerous long-term simulations are required. Therefore, computational effort for simulation is critical. Heat consumers (HC) are numerous and determine the dynamics of mass flows and return temperatures in the DHN. Thus, the way in which HCs are modeled has significant impact on the computational effort and the results of the simulation. This article presents a novel Modelica-based model for HCs that builds on an existing simplified modeling approach (open-loop design). The calculation of mass flow and return temperature is improved in terms of robustness, plausible behavior and low computational effort. In particular, the model reacts to limited differential pressure and supply temperatures to ensure plausible behavior across all operating conditions, including undersupply situations. The model is successfully tested using an exemplary DHN. The analysis proves that the HC model itself requires little time to simulate. Nevertheless, it significantly influences the simulation time for the entire DHN, which varies by a factor of five for the investigated system depending on the HC model. Fast dynamics, including a bypass in the model and correction of deviations between set point and actual heat load increase the simulation time, so users should sensibly choose how to use these options. HC models triggering many state events result in high computational effort. Compared to other simple HC models, the proposed model produces more plausible results while maintaining at least equal simulation performance (for models without bypass) or even improving it (for models with bypass, CPU time is reduced by at least 35%). Full article
(This article belongs to the Special Issue Advances in the Modeling and Simulation of Technical Systems Using Modelica)
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14 pages, 7377 KiB  
Article
Testing the Verification and Validation Capability of a DCP-Based Interface for Distributed Real-Time Applications
by Mikel Segura, Alejandro J. Calderón, Tomaso Poggi and Rafael Barcena
Electronics 2023, 12(24), 4919; https://doi.org/10.3390/electronics12244919 - 6 Dec 2023
Cited by 2 | Viewed by 1044
Abstract
Cyber–physical systems (CPS) integrate diverse elements developed by various vendors, often dispersed geographically, posing significant development challenges. This paper presents an improved version of our previously developed co-simulation interface based on the non-proprietary Distributed Co-Simulation Protocol (DCP) standard, now optimized for broader hardware [...] Read more.
Cyber–physical systems (CPS) integrate diverse elements developed by various vendors, often dispersed geographically, posing significant development challenges. This paper presents an improved version of our previously developed co-simulation interface based on the non-proprietary Distributed Co-Simulation Protocol (DCP) standard, now optimized for broader hardware platform compatibility. The core contributions include a demonstration of the interface’s hardware-agnostic capabilities and its straightforward adaptability across different platforms. Furthermore, we provide a comparative analysis of our interface against the original DCP. It is validated via various X-in-the-Loop simulations, reinforcing the interface’s versatility and applicability in diverse scenarios, such as distributed real-time executions, verification and validation processes, or Intellectual Property protection. Full article
(This article belongs to the Special Issue Advances in the Modeling and Simulation of Technical Systems Using Modelica)
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