RF/MM-Wave/THz Integrated Circuit Design for 5G/6G, Artificial Intelligence, Internet-of-Things, and Future Computing Applications

Dear Colleagues,

As the physical, digital, and biological worlds continue to converge, new technologies and platforms are changing our lives and reshaping our societies and economies. The exponential growth of advanced technologies such as 5G/6G, artificial intelligence (AI), the Internet of things (IoT), and future computing (e.g., DNA computing, neuromorphic computing, quantum computing, and optical or photonic computing) is pushing semiconductor technology to its limits. Also, future networks will become extremely heterogenous, which brings great challenges to wireless connection, spectrum share, as well as data fusion.

Radiofrequency, mm-wave, and terahertz-integrated circuit design play a critical role in transforming these advanced technologies. It is also becoming an important and integral part of any new product and system development. Specifically, these advanced technologies will require smarter and more powerful chips to realize higher data rates, lower latency, faster speed, larger bandwidth, better precision, and smaller power consumption.

Silicon-based technologies are still the best candidates for developing these advanced technologies because they offer large-scale integration and low-cost mass production. Additionally, advances in materials engineering have pushed the maximum operating frequencies of silicon-CMOS and silicon–germanium devices to more than 500 GHz.

Hence, efforts are underway to consider beyond state-of-the-art protocols, future chip design and integration, and even standardized guidelines for 5G/6G wireless communication systems. Therefore, the next generation of wireless communication and semiconductor technology is expected to meet the demands of various challenging use cases that cover a wide range of new applications from 5G/6G communications, mobile computing, AI, and advanced Internet of things to big data, cloud, and edge computing. In addition, good progress has been made in AI in recent years, driven by significant improvements in computing power and the availability of vast amounts of data.

This Special Issue aims to discuss open problems and present new solutions that address the challenges of future communication systems, AI, ubiquitous connectivity, IoT networking, and RF/mm-wave/THz chip design. Topics of interest include:

• Low-power transceivers and synthesizers;
• Ultra-wideband amplifiers;
• Passive or active sub-THz and THz circuits;
• Integrated hybrid electronic–photonic transmitters and receivers;
• Low-power baseband processing for low latency and high throughput;
• Antennas, filters, and switches;
• LNAs, mixers, VCOs, VGAs, PGAs, and dividers;
• Sensors and actuators;
• MIMO;
• Beamforming/beam steering circuits;
• AI hardware acceleration;
• Event-based perception.

Prof. Dr. Kiat Seng Yeo
Dr. Nagarajan Mahalingam
Dr. Bo Wang
Guest Editors

30–31 October 2023
2023 FIRST INTERNATIONAL CONFERENCE

Tianjin, China

The theme of the inaugural FIRST (Fostering Interdisciplinary Research Success Together) international conference is “Interdisciplinarity: The Fusion of Technologies (Semiconductor, Artificial Intelligence, Internet-of-Things, and Communications)”, and it aims to discuss the open problems and present new solutions that address the challenges of future communication systems, artificial intelligence, internet-of-things, and chip design. Specifically, the role of semiconductors in future communications will be presented and how can the semiconductor and communication industry emerge stronger after the pandemic will be discussed.

http://sme.tju.edu.cn/info/1095/2265.htm

https://blackiedong.github.io/indexen.html

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• millimeter-wave circuits and systems
• transceivers
• internet-of-things
• low-power, energy-efficient MMW IC design
• wireless communication systems
• millimeter-wave digital baseband
• advanced MMW IC technologies
• SiP and SOC