Converging Platform Technologies: Collaborative Innovations and Future Directions

Dear Colleagues,

This Special Issue is dedicated to exploring the convergence of platform technologies across diverse disciplines and industries. It seeks to highlight innovations that advance connectivity, functionality, and integration, bridging the gap between theoretical research and practical applications.

We invite authors to submit papers that address any aspect of platform technology, including, but not limited to, computing architectures, smart systems, network solutions, and security frameworks. Contributions that demonstrate novel approaches and offer insights into future challenges and opportunities in platform technologies are particularly welcome.

The purpose of this Special Issue is to assemble a compendium of cutting-edge research that showcases how platform technologies are reshaping the landscape of digital interaction and service delivery. It aims to foster an understanding of these technologies' pivotal roles and to encourage the exploration of potential transformative impacts in various sectors.

By integrating both conference proceedings and external submissions, this Special Issue will enrich the existing dialogue within the technology community. It will serve to expand on the discussions initiated at the 2024 International Conference on Platform Technology and Service (PlatCon-24), providing a broader, more comprehensive view that bridges current research with emerging trends.

Dr. Jihoon Moon
Dr. Dongwann Kang
Prof. Dr. Young-Ae (Claire) Jung
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• platform technology integration
• emerging network systems
• smart technology solutions
• security in digital platforms
• innovative computational models
• advanced computing platforms
• intelligent networking solutions
• multimedia and HCI platforms
• cybersecurity and data privacy
• smart grid technologies
• ubiquitous computing systems
• cloud and distributed computing
• machine-to-machine communications
• virtual and augmented reality
• artificial intelligence in platform services
• IOT and service innovation
• business intelligence platforms
• educational technologies and e-learning
• biotechnology and health informatics platforms
• sustainable and green technologies