Modification, Properties and Application of Epoxy Adhesives/Materials
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Polymeric Materials".
Deadline for manuscript submissions: 20 June 2025 | Viewed by 2862
Special Issue Editors
Interests: analysis of the influence of technological and structural factors on the strength of adhesive joints of polymers and metals; design of bonding technologies; testing of adhesive properties; issues related to obtaining the appropriate adhesive properties to increase the strength of adhesive joints; modification of epoxy adhesives; design of different assembly joint solutions; design of assembly technologies
Special Issues, Collections and Topics in MDPI journals
Interests: modification of epoxy adhesives; design of various assembly joint solutions; design of assembly technology; testing of physical; mechanical and performance properties of structural adhesives; modification of surfaces to improve adhesive properties for increased adhesion strength of adhesive joints; analysis of the influence of technological and structural factors on the strength of adhesive joints of engineering materials; design of bonding technologies
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Epoxy adhesives have properties superior to those of most other adhesive materials due to their excellent adhesion and chemical resistance. Wide varieties of resins and curing agents, together with their excellent capability to be modified (both chemical and physical), allow epoxy adhesives/materials to be adjusted for particular applications and conditions of use. This modification of epoxy materials enables the control of specific properties, such as shear and tensile strengths, tensile modulus, flexibility, and heat resistance.
This Special Issue focuses on types of epoxy adhesives/materials, epoxy resins, curing agents and other various types of additives and fillers, as well as their properties and the resistance of epoxy adhesives in different applications and environments. Epoxy materials are considered in terms of their characteristics, methods of modification, curing, testing and their applications.
Potential topics include, but are not limited to, the following:
- Epoxy resins and curing agents;
- Novel technologies and methods for modification of epoxy adhesives;
- Structure, properties and applications of epoxy adhesive modifies and fillers;
- Mechanical, chemical and thermal properties of epoxy materials;
- Resistance of epoxy adhesives and adhesive joints in various environments;
- Advanced applications of epoxy adhesives;
- Biobased epoxy adhesives and materials;
- Sustainable epoxy resins from renewable resources.
Prof. Dr. Anna Rudawska
Dr. Izabela Miturska-Barańska
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- epoxy resin
- epoxy adhesive
- epoxy adhesive joint
- biobased epoxy adhesive and material
- epoxy composite
- modification
- filler and modifier
- curing agent
- properties
- applications
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