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Recent Advances in Advanced Laser Processing Technologies

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 20 March 2025 | Viewed by 1084

Special Issue Editor


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Guest Editor
1. School of Mechanical and Manufacturing Engineering, Dublin City University, D09 V209 Dublin, Ireland
2. Advanced Processing Technology Research Centre APT, D09 V209 Dublin, Ireland
3. I-Form Advanced Manufacturing Research Centre, D04 C1P1 Dublin, Ireland
Interests: laser processing; material processing; material functionalisation; nanostructured materials; rapid prototyping; chromatography
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Laser processing is a groundbreaking technique that is revolutionizing advanced manufacturing across a wide range of materials. With its notable advantages of high efficiency, superior quality, automation, and customization, laser processing techniques have found extensive applications in various industrial sectors, including aerospace, energy, transportation, and healthcare. However, the demands of manufacturing technology in these industries are constantly evolving, becoming more complex and stringent. It is evident that further research is necessary to enhance our understanding of process physics, to optimize processes, and to develop novel applications.

This Special Issue aims to create a platform for showcasing cutting-edge advancements, inspiring new developments and promoting the applications of laser material processing. We welcome both original research papers and reviews from scientists, researchers, engineers, and experts in this field. Topics of interest include the following areas:

  • Laser processing and additive manufacturing;
  • Laser machining, including cutting/drilling/texturing;
  • Laser forming, including bending/rapid prototyping/coloring/deposition;
  • Laser joining, including laser welding/brazing/soldering/sintering;
  • Laser–matter interaction in material processing;
  • Laser-based surface engineering.

Prof. Dr. Dermot Brabazon
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • laser material processing
  • laser welding
  • laser additive manufacturing
  • process simulation
  • process monitoring and/or control
  • metallurgical and mechanical behavior
  • quality control

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Published Papers (1 paper)

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Research

16 pages, 4892 KiB  
Article
Fabrication of Silicon Carbide Nanoparticles Using Pulsed Laser Ablation in Liquid and Viscosity Optimization via Solvent Tuning
by Saeid Heidarinassab, Anesu Nyabadza, Inam Ul Ahad and Dermot Brabazon
Materials 2024, 17(18), 4527; https://doi.org/10.3390/ma17184527 - 14 Sep 2024
Viewed by 808
Abstract
In this study, silicon carbide nanoparticles (NPs) were produced via pulsed laser ablation in liquid, aiming to investigate the influence of processing parameters on the properties of the resultant NPs and their applicability for inkjet printing. The results revealed an increase in NP [...] Read more.
In this study, silicon carbide nanoparticles (NPs) were produced via pulsed laser ablation in liquid, aiming to investigate the influence of processing parameters on the properties of the resultant NPs and their applicability for inkjet printing. The results revealed an increase in NP concentration with increasing laser power, but the maximal absorbance in the case of 0.743 and 1.505 W is lower than that for 1.282 W laser. Dynamic light scattering was employed to determine the size distribution of the NPs, demonstrating a range of 89 to 155 nm in diameter. Notably, an inverse relationship was established between increasing laser scanning speed and pulse repetition rate (PRR) and the mean size of the NPs. Higher PRR and laser power exhibited an augmentation in the concentration of NPs. Conversely, an increase in scanning speed resulted in a reduction in NP concentration. Based on FTIR, data formation of SiC NPs based on the target material is the most dominant behavior observed followed by an amount of oxidation of the NPs. Examination of the resulting NPs through field emission scanning electron microscopy equipped with energy-dispersive X-ray analysis (EDX) unveiled a predominantly spherical morphology, accompanied by particle agglomeration in some cases, and the elemental composition showed silicon, carbon, and some oxygen present in the resulting NPs. Furthermore, the modulation of colloidal solution viscosity was explored by incorporating glycerol, yielding a maximal viscosity of 10.95 mPa·s. Full article
(This article belongs to the Special Issue Recent Advances in Advanced Laser Processing Technologies)
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