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Advanced Materials for Flexible Sensing Applications and Electronics
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Advanced Materials for Flexible Sensing Applications and Electronics

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 20 November 2025 | Viewed by 877

Special Issue Editors

Dr. Linpeng Liu

E-Mail Website
Guest Editor
State Key Laboratory of High Performance and Complex Manufacturing, College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
Interests: flexible electronics; bioinspired functional surfaces; MEMS sensors
Special Issues, Collections and Topics in MDPI journals
Dr. Changchao Zhang

E-Mail Website
Guest Editor
School of Mechanical and Aerospace Engineering, Jilin University, Changchun, China
Interests: flexible electronics; MEMS sensors; bioinspired sensing devices; bioinspired functional surfaces
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Flexible sensing electronics play a crucial role as the primary mediums through which high-end equipment perceives external information. Today, flexible sensing devices based on various functional sensing materials or innovative structural designs provide broad potential applications in human–machine interaction, smart healthcare, and advanced mechanical systems. However, current sensing materials and structures still require further improvements to meet the increasing demands of real-world applications, including enhanced sensitivity, durability, and multifunctionality. This Special Issue aims to present the latest research advancements in advanced sensing materials and structures for applications in wearable electronics, robotic skin, intelligent machinery, and beyond. Topics of interest include but are not limited to, novel material design, flexible and stretchable sensors, self-powered sensing technologies, and integrated multifunctional sensor systems. We invite researchers to submit original research to this Special Issue.

Dr. Linpeng Liu
Dr. Changchao Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible strain sensor
  • flexible pressure sensor
  • sensing microstructure
  • sensing functional surfaces
  • sensing strain materials

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Published Papers (1 paper)

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Research

12 pages, 5474 KB  
Article
Flexible Sensor with Material–Microstructure Synergistic Optimization for Wearable Physiological Monitoring
by Yaojia Mou, Cong Wang, Xiaohu Jiang, Jingxiang Wang, Changchao Zhang, Linpeng Liu and Ji’an Duan
Materials 2025, 18(15), 3707; https://doi.org/10.3390/ma18153707 - 7 Aug 2025
Viewed by 691
Abstract
Flexible sensors have emerged as essential components in next-generation technologies such as wearable electronics, smart healthcare, soft robotics, and human–machine interfaces, owing to their outstanding mechanical flexibility and multifunctional sensing capabilities. Despite significant advancements, challenges such as the trade-off between sensitivity and detection [...] Read more.
Flexible sensors have emerged as essential components in next-generation technologies such as wearable electronics, smart healthcare, soft robotics, and human–machine interfaces, owing to their outstanding mechanical flexibility and multifunctional sensing capabilities. Despite significant advancements, challenges such as the trade-off between sensitivity and detection range, and poor signal stability under cyclic deformation remain unresolved. To overcome the aforementioned limitations, this work introduces a high-performance soft sensor featuring a dual-layered electrode system, comprising silver nanoparticles (AgNPs) and a composite of multi-walled carbon nanotubes (MWCNTs) with carbon black (CB), coupled with a laser-engraved crack-gradient microstructure. This structural strategy facilitates progressive crack formation under applied strain, thereby achieving enhanced sensitivity (1.56 kPa−1), broad operational bandwidth (50–600 Hz), fine frequency resolution (0.5 Hz), and a rapid signal response. The synergistic structure also improves signal repeatability, durability, and noise immunity. The sensor demonstrates strong applicability in health monitoring, motion tracking, and intelligent interfaces, offering a promising pathway for reliable, multifunctional sensing in wearable health monitoring, motion tracking, and soft robotic systems. Full article
(This article belongs to the Special Issue Advanced Materials for Flexible Sensing Applications and Electronics)
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