Electronic Materials
A section of Materials (ISSN 1996-1944).
Section Information
Nowadays, electronic materials are widely used in our daily life. As an example, communication devices, power supplies, energy conversion systems, computers and wireless systems, physical and chemical sensors, solid-state lighting devices, light- and particle-detectors, etc. are all based on the use of a variety of electronic materials, having specific properties and functionalities that are ultimately related to their atomic structure.
Clearly, the comprehension of the fundamental properties of these materials, the development of their processing technology, and their integration in real devices, as well as the correlation of device performance with material properties, require multidisciplinary competences.
The "Electronic Materials" section is a forum for rapid publication of the most recent advances in materials and devices for different areas of interest, e.g., nanotechnology, power and high-frequency electronics, optoelectronic devices, and sensors. In these areas, several materials are the building blocks used for device fabrication: nanostructures, binary and complex oxides, insulators, metallizations, conventional semiconductors (Si, Ge, SiGe, GaAs, etc.), wide-bandgap semiconductors (SiC, GaN, Ga2O3, ZnO, AlN, diamond, etc.), nitride heterostructures, nanowires, 2D materials and compounds (graphene, hexagonal boron nitride, transition metal dichalcogenides, etc.), optical and energy harvesting materials, etc.
Papers based on experimental and theoretical studies on the above electronic materials and related devices are welcome in this section. In addition, the development and/or application of advanced characterization techniques to electronic materials and electronic devices are also in line with the scope of the section.
All the papers submitted for publication in this section will undergo a peer-review process, and the final decisions are made based on the recommendations of independent reviewers.
Editorial Board
Topical Advisory Panel
Special Issues
Following special issues within this section are currently open for submissions:
- Advanced Spintronic Materials and Devices (Deadline: 20 May 2024)
- Dielectrics and Nanodielectrics (Deadline: 20 June 2024)
- Ultra-Wide Bandgap Semiconductor Materials and Devices (Deadline: 20 June 2024)
- Advanced Electrical Engineering Materials and Devices (Deadline: 20 June 2024)
- Investigating the Electronic Properties of 2D Materials and Layered Materials (Deadline: 20 June 2024)
- Electromagnetic Shielding/Absorbing Materials: Preparation, Characterization and Applications (Deadline: 10 July 2024)
- Advances in Electronics Packaging Materials and Technology (Deadline: 20 July 2024)
- Electromechanical Effects in Ferroelectric Materials: Theory, Modeling, and Experiments (Deadline: 10 August 2024)
- Recent Advances on Diamond-Based Optical, Electronic, and Optoelectronic Devices (Deadline: 10 August 2024)
- Electrochromic Materials Research and Devices (Deadline: 20 August 2024)
- Electronic Packaging Materials and Technology Applications (Deadline: 31 August 2024)
- Development of Novel Functional Materials for the Manufacture of Electronic and Optoelectronic Devices (Deadline: 10 September 2024)
- Research Progress of Thermoelectric Materials, Modules and Applications (Deadline: 20 September 2024)
- Research on Thermoelectric Materials and Devices: New Advances in Improving Thermoelectric Efficiency (Deadline: 20 September 2024)
- Piezoelectrics and Ferroelectrics for End Users (Deadline: 20 September 2024)
- Advanced Semiconductor/Memory Materials and Devices (Deadline: 20 September 2024)
- Design, Synthesis, and Applications of Optoelectronic Functional Materials (Deadline: 20 September 2024)
- High-Performance Materials for Thin-Film Transistors and Other Electronic Device Applications (Deadline: 20 September 2024)
- Exploration and Application of Emerging Superconducting Materials (Deadline: 20 September 2024)
- Low-Dimensional Electromagnetic Functional Materials (Deadline: 20 October 2024)
- 2D Materials for Electronic and Optoelectronic Devices (Deadline: 20 October 2024)
- Flexible Electronic Materials and Devices: Preparation and Application (Deadline: 20 October 2024)
- Silicon Carbide Materials: Crystal Growth, Device Processing and Functional Applications (Deadline: 20 October 2024)
- Advanced Materials for Organic Semiconductors and Their Applications (Deadline: 20 November 2024)
- Flexible Piezoelectric Transducers and Materials for Energy Harvesting and Sensing Applications (Deadline: 20 November 2024)
- Metal Oxide Semiconductors: Synthesis, Structure, and Applications (Deadline: 30 November 2024)
- Latest Technologies in the Additive Manufacturing of Flexible and Printable Electronics (Deadline: 1 December 2024)
- Thin Films and Semiconductor Heterostructures: From Fundamental to Applications (Deadline: 20 December 2024)
- Recent Advances in Thermoelectric Materials and Devices/Modules (Deadline: 31 December 2024)