Thermal Reliability of Advanced Materials and Structures
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Mechanics of Materials".
Deadline for manuscript submissions: 20 December 2024 | Viewed by 794
Special Issue Editors
Interests: solid mechanics; multiscale modeling; fracture mechanics; heat transfer; material characterization
Special Issues, Collections and Topics in MDPI journals
Interests: fracture mechanics; micromechanics; mathematical modeling
Interests: fracture mechanics; heat transfer; mathematical modeling
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Advanced materials with various functionalities or structural features have been increasingly utilized in recent years to meet the sophisticated demands of modern technology. These materials encompass soft materials, functionally graded materials, quasicrystals, and smart materials and structures. Thermal failure presents a significant concern for many advanced materials and structures across diverse thermal environments. Examples include space exploration devices operating in extreme temperatures, high-energy laser manufacturing of microelectronic devices, combustion chambers in jet engines, overheating of electronic devices during service cycles, and thermal fatigue of solar panels, among others. Gaining a deeper understanding of thermal failure mechanisms is crucial for designing reliable advanced materials and structures.
This Special Issue is dedicated to exploring the thermal reliability of advanced materials and structures under various thermal disturbances. Topics range from transient heating in ultrafast laser fabrication to the quenching of advanced metal alloys, thermal cycles in electronic devices, and transient heat conduction in heterogeneous microstructures. We welcome papers that address heat conduction, thermal stress analysis, thermal fatigue and fracture of advanced materials and structures, and related subjects. By showcasing recent advancements in this critical area, we aim to enhance our understanding of the thermal reliability of advanced materials and structures.
Prof. Dr. Zengtao Chen
Prof. Dr. Keqiang Hu
Prof. Dr. Wenzhi Yang
Guest Editors
Manuscript Submission Information
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Keywords
- heat conduction
- thermal impact
- thermal stress analysis
- advanced materials and structures
- fatigue and fracture
- thermal barriers
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