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Flexible Electronic Materials and Devices: Preparation and Application
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Flexible Electronic Materials and Devices: Preparation and Application

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 20 October 2024 | Viewed by 1080

Special Issue Editor

Dr. Shu-Jen Wang

E-Mail Website
Guest Editor
Department of Physics, Hong Kong Baptist University, Kowloon Tong, Hong Kong, China
Interests: organic semiconductors

Special Issue Information

Dear Colleagues,

Flexible electronics have advanced significantly in the past decade, enabling their application in numerous domains where conventional rigid electronics cannot be applied, such as bioelectronics and electronic sensors, etc. Two main strategies have been proposed to introduce flexibility in electronic materials: reducing the thickness of commercially available inorganic semiconductor materials and designing novel semiconductor materials with intrinsic mechanical flexibility. A wide range of materials (inorganic semiconductors, organic semiconductors, oxide semiconductors and 2D materials) have been used to realize flexible electronic devices for various applications. Further advances in flexible electronic devices would require the matrimony of material synthesis, device physics and engineering, and advanced characterization expertise to enable the development of high-performance devices with decent reliability for practical real-world applications.

This Special Issue aims to compile research papers, short communications, and review articles focused on the synthesis of novel materials, device design, fabrication, and the advanced characterization of various flexible electronic devices for the identication of the main milestones in the roadmap of future flexible electronics research.

Dr. Shu-Jen Wang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • biosensors and bioelectronics
  • thin-film transistors
  • flexible chemical sensors
  • flexible electronic materials
  • flexible healthcare sensors
  • advanced characterization
  • novel device architectures
  • new flexible materials synthesis
  • reliability of flexible devices

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Published Papers (2 papers)

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Research

13 pages, 4242 KiB  
Article
Alkylated MXene–Carbon Nanotube/Microfiber Composite Material with Flexible, Superhydrophobic, and Sensing Properties
by Siyu Wang, Dawei Xia, Xinyu Xu, Haoyang Song and Yongquan Qing
Materials 2024, 17(18), 4499; https://doi.org/10.3390/ma17184499 - 13 Sep 2024
Viewed by 235
Abstract
Superhydrophobic strain sensors are highly promising for human motion and health monitoring in wet environments. However, the introduction of superhydrophobicity inevitably alters the mechanical and conductive properties of these sensors, affecting sensing performance and limiting behavior monitoring. Here, we developed an alkylated MXene–carbon [...] Read more.
Superhydrophobic strain sensors are highly promising for human motion and health monitoring in wet environments. However, the introduction of superhydrophobicity inevitably alters the mechanical and conductive properties of these sensors, affecting sensing performance and limiting behavior monitoring. Here, we developed an alkylated MXene–carbon nanotube/microfiber composite material (AMNCM) that is simultaneously flexible, superhydrophobic, and senses properties. Comprising a commercially available fabric substrate that is coated with a functional network of alkylated MXene/multi-walled carbon nanotubes and epoxy–silicone oligomers, the AMNCM offers high mechanical and chemical robustness, maintaining high conductivity and strain sensing properties. Furthermore, the AMNCM strain sensor achieves a gauge factor of up to 51.68 within a strain range of 80–100%, and exhibits rapid response times (125 ms) and long-term stability under cyclic stretching, while also displaying superior direct/indirect anti-fouling capabilities. These properties position the AMNCM as a promising candidate for next-generation wearable devices designed for advanced environmental interactions and human activity monitoring. Full article
(This article belongs to the Special Issue Flexible Electronic Materials and Devices: Preparation and Application)
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15 pages, 4036 KiB  
Article
The Synthesis of Copper Nanoparticles for Printed Electronic Materials Using Liquid Phase Reduction Method
by Kai Li and Xue Jiang
Materials 2024, 17(13), 3069; https://doi.org/10.3390/ma17133069 - 21 Jun 2024
Viewed by 587
Abstract
This text discusses the synthesis of copper nanoparticles via a liquid phase reduction method, using ascorbic acid as a reducing agent and CuSO4·5H2O as the copper source. The synthesized copper nanoparticles are small in size, uniformly distributed, are mostly [...] Read more.
This text discusses the synthesis of copper nanoparticles via a liquid phase reduction method, using ascorbic acid as a reducing agent and CuSO4·5H2O as the copper source. The synthesized copper nanoparticles are small in size, uniformly distributed, are mostly between 100–200 nm with clear boundaries between particles, and exhibit excellent dispersibility, making them suitable for metal conductive inks. 1. The copper nanoparticles are analyzed for good antioxidation properties, because their surface is coated with PVP and ascorbic acid. This organic layer somewhat isolates the particle surface from contact with air, preventing oxidation, and accounts for about 9% of the total weight. 2. When the prepared copper nanoparticles are spread on a polyimide substrate and sintered at 250 °C for 120 min, the resistivity can be as low as 23.5 μΩ·cm, and at 350 °C for 30 min, the resistivity is only three times that of bulk copper. 3. The prepared conductive ink, printed on a polyimide substrate using a direct writing tool, shows good flexibility before and after sintering. After sintering at 300 °C for 30 min and connecting the pattern to a circuit with a diode lamp, the diode lamp is successfully lit. 4. This method produces copper nanoparticles with small size, good dispersion, and antioxidation capabilities, and the conductive ink prepared from them demonstrates good conductivity after sintering. Full article
(This article belongs to the Special Issue Flexible Electronic Materials and Devices: Preparation and Application)
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