Simulation and Reliability Assessment of Advanced Packaging
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Simulation and Design".
Deadline for manuscript submissions: closed (20 February 2022) | Viewed by 48354
Special Issue Editor
Interests: design and reliability assessment of advanced electronic packaging; nanomechanics and nanostructure analysis; artificial intelligence algorithms; computational solid mechanics; AI-assisted design-on-simulation technology
Special Issue Information
Dear Colleagues,
Simulation-based technology plays an important role in the design, structure optimization, and evaluation of the reliability life of advanced packaging, which has become a design trend in the electronics packaging community. The purpose of this Special Issue is to introduce the latest research results of simulation-based technology in advanced packaging today, and the topics to be covered include material characterization of electronic packaging, theoretical or empirical work, modeling, simulation technology, design and validation, AI-assisted design-on-simulation technology, and reliability life prediction. Prospective authors are encouraged to contribute their original and unpublished works in the abovementioned areas.
It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, letters, and reviews are all welcome.
Prof. Dr. Kuo-Ning Chiang
Guest Editor
Manuscript Submission Information
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Keywords
- simulation
- reliability assessment
- electronic packaging
- design
- artificial intelligence
- advanced packaging
- wafer level packaging
- stress/strain
- thermal
- electromigration
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