materials-logo

Journal Browser

Journal Browser

Dielectric Polymer Materials: Fabrication, Characterization and Application

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Physics".

Deadline for manuscript submissions: closed (31 July 2021) | Viewed by 9345

Special Issue Editor


E-Mail Website
Guest Editor
Smart Materials and Nanodielectrics Laboratory, Department of Materials Science, University of Patras, 26504 Patras, Greece
Interests: smart materials; polymer nanocomposites; polymers; nanodielectrics; dielectric behavior; conductivity; storing/retrieving energy; stimuli-responsive materials; active dielectrics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Polymers constitute an important class of engineering materials in everyday life and high-tech applications. The majority of polymers and polymer-based composites are classified as insulators, because they exhibit very low conductivity. Thermoplastics, thermosettings, elastomers, biopolymers, polymer blends, and their micro- and nanocomposites belong to this category. All of them are considered to be dielectric materials, and their electrical performance is related to their polarization, dielectric permittivity and loss, relaxation phenomena, interfacial effects, conductance mechanisms, and dielectric breakdown strength. The dielectric response of polymer dielectrics can be tuned by controlling the fabrication method and the ingredients.

Current and potential applications of polymer-based dielectrics include, but are not limited to, integrated capacitors, hybrid electric vehicles, cellular phones, microelectronic devices, packaging, solar cells, batteries, strain sensors, interlayer capacitors, self-current regulators, wireless personal digital assistance, electromagnetic shielding, energy storage devices, and so on.

In this Special Issue on “Dielectric Polymer Materials: Fabrication, Characterization, and Application”, we welcome original research and reviews on experimental or theoretical/computational studies of all kinds on polymer-based dielectric materials. The design and fabrication of novel polymer-based dielectric materials, polymer matrix micro- and nanocomposites and hybrids, biological systems, electrical engineering devices, insulation systems, stimuli-responsive materials, smart materials, the structure–properties relationship, and all kinds of current and forthcoming applications comprise a short—and definitely not exhaustive—list of the possible subjects for this Special Issue. 

Prof. Georgios C. Psarras
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Polymers
  • Polymer micro/nano-composites
  • Hybrids
  • Dielectric permittivity
  • Dielectric loss
  • Insulation
  • Relaxations
  • Molecular mobility
  • Polarization
  • Interfacial effects
  • Conductivity mechanisms
  • Glass-to-rubber transition
  • Stimuli-responsive polymers
  • Multifunctional materials
  • Nanodielectrics
  • Energy materials

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (3 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

12 pages, 4002 KiB  
Article
Flexibility of Biodegradable Polymer Stents with Different Strut Geometries
by Chong Chen, Yan Xiong, Zhongyou Li and Yu Chen
Materials 2020, 13(15), 3332; https://doi.org/10.3390/ma13153332 - 27 Jul 2020
Cited by 6 | Viewed by 2798
Abstract
Objective: Biodegradable stents (BDSs) represent a new technological development in the field of cardiovascular angioplasty; good flexibility helps stents pass through tortuous vessels during delivery and reduces the amount of damage caused to blood vessels. This study investigates the relationship between flexibility and [...] Read more.
Objective: Biodegradable stents (BDSs) represent a new technological development in the field of cardiovascular angioplasty; good flexibility helps stents pass through tortuous vessels during delivery and reduces the amount of damage caused to blood vessels. This study investigates the relationship between flexibility and the geometry of BDS struts. Methods: Four stent struts with different geometry (circular, triangular, hexagonal, and spline curved) and the same links were modeled to evaluate their flexibility via a three-point bending experimental method and a numerical method. Results: The bending state of the four stents was well-balanced. The bending effect of the four stents was different. Under the same conditions, the circular and spline curved stents showed the best bending effects while the hexagonal stent was the worst. However, these differences were not significant. Conclusion: The flexibility of BDSs is related to the geometry of the struts and links; however, the geometry of the struts has less effect on flexibility than the links. The greater the area enclosed by the strut centerline, the better flexibility of the stent. Full article
Show Figures

Figure 1

10 pages, 4383 KiB  
Article
Performance of Silicone Rubber Composites Filled with Aluminum Nitride and Alumina Tri-Hydrate
by Jianjun Zheng, Shaojian He, Jiaqi Wang, Wenxuan Fang, Yang Xue, Liming Xie and Jun Lin
Materials 2020, 13(11), 2489; https://doi.org/10.3390/ma13112489 - 29 May 2020
Cited by 16 | Viewed by 2579
Abstract
In this study, silicone rubber (SR) composites were prepared with various amounts of aluminum nitride (AlN) and alumina tri-hydrate (ATH), and vinyl tri-methoxysilane (VTMS) was also introduced to prepare SR/ATH/AlN–VTMS composites for comparison. Compared to the SR/ATH composites, the SR/ATH/AlN composites with higher [...] Read more.
In this study, silicone rubber (SR) composites were prepared with various amounts of aluminum nitride (AlN) and alumina tri-hydrate (ATH), and vinyl tri-methoxysilane (VTMS) was also introduced to prepare SR/ATH/AlN–VTMS composites for comparison. Compared to the SR/ATH composites, the SR/ATH/AlN composites with higher AlN loading exhibited higher breakdown strength and thermal conductivity, which were further improved by the addition of VTMS. Such results were related to the enhanced rubber–filler interfacial interactions from VTMS coupling, as demonstrated by scanning electron microscopy (SEM) analysis and the curing behaviors of the SR composites. Moreover, by replacing ATH with VTMS-coupled AlN, the SR/ATH/AlN–VTMS composites also exhibited lower dielectric loss along with an increased dielectric constant, suggesting the promising application of VTMS-coupled AlN as a filler for the preparation of the SR composites as high-voltage insulators. Full article
Show Figures

Figure 1

12 pages, 4015 KiB  
Article
Temperature Effects on the Dielectric Properties and Breakdown Performance of h-BN/Epoxy Composites
by Yongzhe Tang, Peng Zhang, Mingxiao Zhu, Jiacai Li, Yuxia Li, Ziguo Wang and Liangsong Huang
Materials 2019, 12(24), 4112; https://doi.org/10.3390/ma12244112 - 9 Dec 2019
Cited by 28 | Viewed by 3330
Abstract
Epoxy–boron nitride composites are promising insulating materials, and it is highly important to understand their insulating performances at different temperatures with different nano-doping amounts. In this study, we investigated the effects of different mass fractions of epoxy–micron hexagonal boron nitride composites on their [...] Read more.
Epoxy–boron nitride composites are promising insulating materials, and it is highly important to understand their insulating performances at different temperatures with different nano-doping amounts. In this study, we investigated the effects of different mass fractions of epoxy–micron hexagonal boron nitride composites on their thermal conductivity, as well as the effects of temperature and mass fraction on their insulating performances. The results demonstrated that the thermal conductivity of epoxy–micron hexagonal boron nitride composites was superior to that of neat epoxy. The thermal conductivity of epoxy–micron hexagonal boron nitride composites increased with the mass fraction of hexagonal boron nitride, and their dielectric constant and dielectric loss increased with temperature. The dielectric constant of epoxy–micron hexagonal boron nitride composites decreased as the mass fraction of hexagonal boron nitride increased, while their dielectric losses decreased and then increased as the mass fraction of hexagonal boron nitride increased. Due to internal heat accumulation, the alternating current breakdown strength of epoxy–micron hexagonal boron nitride composites increased and then decreased as the mass fraction of hexagonal boron nitride increased. Additionally, as the temperature increased, the composites transitioned from the glassy state to the rubbery or viscous state, and the breakdown strength significantly degraded. Full article
Show Figures

Figure 1

Back to TopTop