Solidification and Microstructure of Metallic Alloys

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Metal Casting, Forming and Heat Treatment".

Deadline for manuscript submissions: 30 November 2025 | Viewed by 352

Special Issue Editor

School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China
Interests: Al alloy; microstructure; mechanical properties

Special Issue Information

Dear Colleagues,

Solidification is a fundamental process governing the microstructure evolution and final properties of metallic alloys. This Special Issue aims to publish cutting-edge research on the interplay between solidification mechanisms, microstructure formation, and performance optimization in both traditional and advanced alloy systems. Topics of interest include, but are not limited to, the following: experimental and computational studies of nucleation/growth kinetics, phase selection, dendritic/cellular solidification, eutectic and peritectic reactions, and defect formation. Contributions exploring novel characterization techniques, multi-scale modeling approaches, and emerging applications (additive manufacturing, high-entropy alloys) are particularly encouraged. By bridging theoretical insights with industrial relevance, this Special Issue seeks to advance the understanding of solidification science and its role in tailoring microstructures for enhanced mechanical, thermal, and functional properties.

Dr. Fang Liu
Guest Editor

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Keywords

  • solidification
  • microstructure evolution
  • metallic alloys
  • phase-field modeling
  • solidification defects
  • additive manufacturing
  • dendritic growth
  • heterogeneous nucleation
  • high-entropy alloys
  • in situ characterization

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Published Papers (1 paper)

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Research

16 pages, 13804 KB  
Article
The Effect of Cobalt Incorporation on the Microstructure and Properties of Cu(Co) Alloys for Use in Hybrid Bonding
by Sarabjot Singh and Kathleen Dunn
Metals 2025, 15(9), 1023; https://doi.org/10.3390/met15091023 - 15 Sep 2025
Viewed by 180
Abstract
In this study, the properties of Cu(Co) alloy films were investigated to assess their utility as an alternative material for interconnections in hybrid bonding applications. Thin films of Cu(Co) were deposited using electrochemical deposition in a standard sulfate-based electrolyte. X-ray photoelectron spectroscopy (XPS) [...] Read more.
In this study, the properties of Cu(Co) alloy films were investigated to assess their utility as an alternative material for interconnections in hybrid bonding applications. Thin films of Cu(Co) were deposited using electrochemical deposition in a standard sulfate-based electrolyte. X-ray photoelectron spectroscopy (XPS) of the films revealed that an increasing current density during deposition resulted in an increase in cobalt concentration. Bright-field scanning transmission electron microscopy (STEM) coupled with energy-dispersive x-ray spectroscopy (EDS) was used to visualize the fine-grained microstructure and confirmed grain boundary segregation of cobalt in the films. X-ray diffraction with a heated stage determined that the coefficient of thermal expansion (CTE) increased linearly with increasing cobalt content, from 17.5 ppm/K for pure copper to a maximum of 27.5 ppm/K for a film containing 24 at.% Co. Nanoindentation experiments found that the mechanical properties depended non-linearly on composition, with hardness increasing from 3.5 GPa for a 0% cobalt film to a maximum of 4.5 GPa (24 at.% Co) and the Young’s modulus increasing from 118 GPa to 214 GPa, respectively. Four-point probe electrical measurements confirmed the expected linear increase in resistivity as Co content increased. Since electrical and mechanical properties have differing dependences on the film composition, an optimal alloy composition that balances an acceptable increase in resistance with improved mechanical properties could enable more reliable, low-temperature bonding solutions in advanced microelectronic devices. Full article
(This article belongs to the Special Issue Solidification and Microstructure of Metallic Alloys)
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