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Metals
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High Performance Copper Alloy
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High Performance Copper Alloy

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: closed (31 December 2023) | Viewed by 1953

Special Issue Editor

Prof. Dr. Yongqin Chang

E-Mail Website
Guest Editor
School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
Interests: high perfomance of CuCrZr and dispersion copper alloys

Special Issue Information

Dear Colleagues,

High-perfomance copper alloys have attracted much attention because of their high mechanical strength, excellent electrical conductivity, and good fatigue properties as well as thermal stability, and include Cu-Cr-Zr alloys, Cu-Ni-Si alloys, Cu-Ag alloys, Cu-Mg alloys, Cu-Al2O3 composites, and Cu-W composites. High-perfomance copper alloys have been widely used in the fields of integrated circuit lead frames, resistance welding electrodes, vacuum contact switches, casting molds, high-speed rail transit, and thrust chambers of rocket engines.

It is important to improve existing copper alloys and develop novel copper alloys, including enhancing mechanical properties with comparable thermal or electrical properties in addition to improving high-temperature creep properties and high-temperature softening resistance. For oxide dispersion copper composites, it is necessary to explore production processes with a large size, high efficiency, and low costs.

Prof. Dr. Yongqin Chang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • copper alloys
  • characterization
  • microstructure
  • strength
  • ductility
  • electrical conductivity
  • thermal conductivity
  • thermal stability
  • corrosion
  • wear
  • manufacturing

Published Papers (1 paper)

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Research

13 pages, 15110 KiB  
Article
Improving Structural Stability and Thermal Stability of Copper Alloy by Introducing Completely Coherent Ceramic Dispersoids
by Yilin Guo, Qinghao Yang, Mingjia Li, Liang Li, Guodong Sun, Longlong Dong and Mingyang Li
Metals 2023, 13(2), 338; https://doi.org/10.3390/met13020338 - 8 Feb 2023
Cited by 1 | Viewed by 1468
Abstract
When ceramic particles are incoherent with copper matrices, or when large coherent strains exist due to the differences between their crystal structure and lattice parameters in traditional dispersion-strengthened copper alloys, the strengthening effect of dispersoids at high temperatures is reduced. In the present [...] Read more.
When ceramic particles are incoherent with copper matrices, or when large coherent strains exist due to the differences between their crystal structure and lattice parameters in traditional dispersion-strengthened copper alloys, the strengthening effect of dispersoids at high temperatures is reduced. In the present work, a Cu-0.48Al-3.5Yb2O3 alloy was fabricated by mechanical alloying and spark plasma sintering. The investigation results prove that completely coherent inert ceramic particle YbAlO3 without coherent strains is introduced into the copper matrix. The microstructural evolution and thermal stability of the alloy after annealing at high temperatures are investigated and discussed, and it is found that the alloys exposed at 600~800 °C for 3 h exhibit excellent thermal stability and exceptional structural stability. The exceptional resistance to grain growth in the alloy can be attributed to the Zener pinning effect provided by the fine dispersion of YbAlO3 particles. High-density geometrically necessary dislocation (GND) is retained in the alloy even after annealing at 800 °C for 3 h, as is the presence of parallel GND rows because they do not easily react with opposite rows to annihilate the dislocation. At the same time, dispersed YbAlO3 acts as a strong obstacle to moving the GND. The present work proves that the structural stability of copper can be significantly improved by introducing completely coherent dispersed particles. Full article
(This article belongs to the Special Issue High Performance Copper Alloy)
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