Novel Technologies for Metal Microjoining
A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Welding and Joining".
Deadline for manuscript submissions: closed (31 December 2023) | Viewed by 1138
Special Issue Editors
2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150000, China
Interests: electronics packaging; microjoining; reliability; wearable technology; solder alloys; soldering; computational materials science
Special Issue Information
Dear Colleagues,
Microjoining is a critical process in microelectronic packaging, and is crucial for manufacturing many other extremely small components, devices and systems, such as medical implants, sensors and transducers, batteries, and optoelectronics. Generally, microjoining provides mechanical support, electrical connection, and environmental protection for assembly of electronic and biomedical devices. Effective microjoining has become one of the most essential technical prerequisites for success in manufacturing at ever-smaller scales. While many microjoining processes and applications become commonplace, microjoining continues to face fresh challenges because of ever advancing miniaturization.
This Special Issue aims to give an updated outlook on the application of novel microjoining technology to metals. We invite you to submit scientific manuscripts that present new findings on materials, structures, and processes in microjoing using experimental analysis, numerical simulation and intelligent algorithms. Novel findings regarding nanojoining and other bottom-up assembly techniques are also welcome, provided that the technology can be used for metals.
Dr. Rong An
Guest Editor
Dr. Xiaoliang Ji
Guest Editor Assistant
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- microjoining technology
- microstructure
- scale effect
- manufacturing processes
- reliability
- interconnection materials
- extreme environment
