Ultra-Thin and Micro Heat Pipe Manufacturing and Their Applications
A special issue of Metals (ISSN 2075-4701).
Deadline for manuscript submissions: closed (31 October 2022) | Viewed by 3059
Special Issue Editor
Interests: micro-scale enhanced heat transfer theory and experimental research; heat pipe two-phase flow and heat transfer model; micro-thermoelectric conversion system
Special Issue Information
Dear Colleagues,
The reducing size and improving performance of electronic devices such as smartphones, tablet computers and micro/meso-spacecrafts have led to a dramatic increase of heat fluxes generated by the internal electronic components. Thermal management has been becoming a bottleneck that restricts the further development of electronic devices. Ultra-thin and micro heat pipes, as two-phase passive heat spreaders, are an effective and promising solution for the cooling of mobile electronics.
However, it is very difficult to fabricate an ultra-thin and micro heat pipes with an expected high thermal conductivity. The manufacturing and packaging processes of these fine devices, coupled with the selection and preparation of the appropriate case material, wick structure and working fluid, are very challenging and should be studied carefully, which determines the heat-transfer performance of the ultra-thin and micro heat pipes in academia and industry.
This Special Issue is focused on the manufacturing process and the application status of ultra-thin and micro heat pipes. Articles focusing on new fabrication technologies, including but not limited to different materials, novel wick designs and assembly techniques, new test methods, and application extension of the ultra-thin and micro heat pipe, will be welcomed and reviewed as soon as possible.
Dr. Ji Li
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- microscale
- heat pipe
- loop heat pipe
- pulsating heat pipe
- flat heat pipe
- ultra-thin
- heat transfer
- manufacturing
- application
