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Micromachines
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Feature Papers of Micromachines in Physics 2024
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Feature Papers of Micromachines in Physics 2024

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 1203

Special Issue Editor

Prof. Dr. Yi Zhang

grade E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: micro/nanomedicine; microfluidics; diagnostics; biosensing; nanomaterials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to announce this Special Issue, entitled "Feature Papers of Micromachines in Physics 2024". Over the past several years, we have worked in conjunction with excellent scholars and research groups to publish several high-impact, high-quality manuscripts, which have received a large number of views and citations. Our goal is to publish the latest scientific and technological advances in areas related to the fundamentals and physics of micro/nanoscale multiphysics phenomena and devices (N/MEMS, mechanical and electrical transducers, sensors, actuators, optic devices, photonic devices, optoelectronic devices, micro/nanorobots, and so on), in the hopes of providing great contributions to the scientific community.

This Special Issue will be a collection of high-quality papers from excellent scholars around the world, with both original research articles and comprehensive review papers being welcome, published with full open access after a peer-review, benefiting both authors and readers.

You are welcome to send short proposals for the submission of Feature Papers to our Editorial Office ([email protected] or ) before the submission. The proposals will first be evaluated by editors, and please note that the selected full papers will still be subject to a thorough and rigorous peer-review.

We look forward to receiving your excellent work.

Prof. Dr. Yi Zhang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Further information on MDPI's Special Issue polices can be found here.

Published Papers (2 papers)

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Research

11 pages, 13459 KiB  
Article
Textile Bandwidth-Enhanced Half-Mode Substrate-Integrated Cavity Antenna Based on Embroidered Shorting Vias
by Feng-Xue Liu, Fan-Yu Meng, Yu-Jia Chen, Zhou-Hao Gao, Jie Cui and Le Zhang
Micromachines 2024, 15(9), 1081; https://doi.org/10.3390/mi15091081 - 27 Aug 2024
Viewed by 383
Abstract
A textile bandwidth-enhanced half-mode substrate-integrated cavity (HMSIC) antenna based on embroidered shorting vias is designed. Based on the simulated results of the basic HMSIC antenna, two embroidered hollow posts with square cross-sections are added as shorting vias at the intersections of the zero-E [...] Read more.
A textile bandwidth-enhanced half-mode substrate-integrated cavity (HMSIC) antenna based on embroidered shorting vias is designed. Based on the simulated results of the basic HMSIC antenna, two embroidered hollow posts with square cross-sections are added as shorting vias at the intersections of the zero-E traces of the TM210HM and TM020HM modes to shift the TM010HM-mode band to merge with the bands of the higher-order modes for bandwidth enhancement. A prototype is practically fabricated based on computerized embroidery techniques. Measurement results show that the prototype is of an expanded −10 dB impedance band of 4.87~6.17 GHz (23.5% fractional bandwidth), which fully covers the 5 GHz wireless local area network (WLAN) band. The simulated radiation efficiency and maximum gain of the proposed antenna are above 97% and 7.6 dBi, respectively. Furthermore, simulations and measurements prove its robust frequency response characteristic in the proximity of the human tissues or in bending conditions, and the simulations of the specific absorption rate (SAR) prove its electromagnetic safety on the human body. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in Physics 2024)
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23 pages, 4997 KiB  
Article
Electromigration in Nano-Interconnects: Determining Reliability Margins in Redundant Mesh Networks Using a Scalable Physical–Statistical Hybrid Paradigm
by Houman Zahedmanesh
Micromachines 2024, 15(8), 956; https://doi.org/10.3390/mi15080956 - 26 Jul 2024
Viewed by 507
Abstract
This paper presents a hybrid modelling approach that combines physics-based electromigration modelling (PEM) and statistical methods to evaluate the electromigration (EM) limits of nano-interconnects in mesh networks. The approach, which is also compatible with standard Place and Route (P&R) tools and practises, takes [...] Read more.
This paper presents a hybrid modelling approach that combines physics-based electromigration modelling (PEM) and statistical methods to evaluate the electromigration (EM) limits of nano-interconnects in mesh networks. The approach, which is also compatible with standard Place and Route (P&R) tools and practises, takes into account the positive impact of network redundancy on EM current limits. The numerical simulations conducted in this study show that conventional methods underestimate the EM current limits of a power delivery network (PDN) unit-cell by 80% due to their lack of consideration for redundancy. Additionally, the time-to-failure (TTF) distributions of a PDN unit-cell obtained by the developed modelling framework adhered to a lognormal distribution, where the lognormal sigma, σlogn, exhibits a 55% reduction compared to that of the single constituent interconnects. The study also found the negative voltage (i.e., ground or Vss) grid to be more susceptible to EM than the positive voltage, i.e., Vdd grid. In the examined grid unit-cell design, both the number of interconnect sites prone to voiding and also the magnitude of the peak tensile stress within the nano-interconnects were found to be two times as high in the Vss case compared to Vdd. The lognormal sigma of TFF for the grid unit-cells, σlogn−tile, show a marked reduction compared to the lognormal sigma of the constituent single interconnects, σlogn, with a 50% and 66% decrease compared to single interconnects, for downstream (Vss) and upstream (Vdd), respectively. In addition, σlogn−tile was three times higher for downstream (Vss) compared to upstream (Vdd), whilst, in contrast, this difference was only 2-fold at the single interconnect level. TTF50% was predicted to be 4.13-fold higher at the grid unit-cell level for the upstream compared to downstream operation, which was also more pronounced than in the single interconnect level where the difference was only 2-fold. This research provides valuable insights into the EM ageing of nano-interconnects in mesh networks and could pragmatically enhance the accuracy of EM compliance evaluation methods. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in Physics 2024)
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