MEMS Packaging Technologies and 3D Integration, 3rd Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 31 December 2024 | Viewed by 2488
Special Issue Editor
Interests: packaging; MEMS; integration; bonding; polymer; adhesion
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
MEMS packaging is essential technique to the successful commercialization of MEMS products, as MEMS has moving parts and an application-specific nature. The classic approach to MEMS packaging involves the bonding of silicon or glass cap wafers to MEMS wafers. Therefore, it is typically implemented under high-pressure and high-temperature conditions. Advanced approaches use the thin-film deposition technique, and then the cavity for MEMS is realized via sacrificial etch through access holes at the thin-film cap. The packaging cap transfer technique is a compromise between the two approaches, making it possible to bond and transfer the thin packaging cap to the released MEMS device. MEMS devices and IC are being integrated into 3D fashion to achieve better performance, but the implantable device requires special packaging techniques. Thus, this Special Issue seeks research papers, communications, and review articles that focus on MEMS packaging technologies and related integration methods.
Dr. Seonho Seok
Guest Editor
Manuscript Submission Information
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Keywords
- MEMS
- packaging
- bonding
- integration
- vacuum
- implantable
- biocompatibility
- reliability
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Related Special Issues
- MEMS Packaging Technologies and 3D Integration in Micromachines (14 articles)
- MEMS Packaging Technologies and 3D Integration, 2nd Edition in Micromachines (7 articles)
