Micro/Nano Manufacturing of Electronic Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 31 March 2025 | Viewed by 865
Special Issue Editors
Interests: sealing of microwave devices; brazing; interfacial behavior regulation; microstructure
Interests: dissimilar material welding; laser micro-welding; laser beam control; Interfacial reaction; mechanical properties
Interests: vacuum electronic devices; passive pulse compressor; microwave biosensor; dielectric microwave measurement
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
As the demand for more sophisticated and miniaturized electronic devices accelerates, micro/nano manufacturing technologies are playing a pivotal role in shaping the future of electronic components. This Special Issue aims to spotlight the latest advancements in micro/nano-scale processes, containing micro-joining, laser micromachining, etc., and their applications in electronic devices. These technologies are integral to modern electronic manufacturing, driving innovations that enhance device performance, reliability, and integration.
We invite researchers and engineers to contribute original research articles and comprehensive reviews that explore the following areas, among others: advancements in soldering techniques and materials, laser micromachining technologies, and the development of micro/nanostructures for surface and interface engineering. Contributions that address modeling, simulation, reliability assessments, and manufacturing tools in these domains are also highly encouraged.
This Special Issue seeks to provide a platform for sharing breakthroughs and fostering collaboration in the intersection of micro/nano manufacturing of electronic device fabrication, advancing both fundamental understanding and practical applications in this rapidly evolving field.
Dr. Haoyue Li
Prof. Dr. Guo Liu
Guest Editors
Dr. Qianqian Chen
Guest Editor Assistant
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- micromachining of vacuum electronic devices
- interface engineering of sensors
- microelectronics assembly
- micro/nano-scale processes
- micro-joining
- laser micromachining
- emerging microfabrication technologies
- micro/nanostructures for surface and interface engineering
- reliability assessment
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