Development of CMOS-MEMS/NEMS Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".
Deadline for manuscript submissions: closed (30 September 2018) | Viewed by 59794
Special Issue Editors
Interests: CMOS-MEMS/NEMS devices; MEMS resonators nonlinearities; VLSI CMOS design
Special Issue Information
Dear Colleagues,
Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).
Dr. Jaume Verd
Prof. Dr. Jaume Segura
Guest Editors
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Keywords
- MEMS/NEMS sensors
- CMOS-MEMS/NEMS Fabrication technologies
- RF MEMS and Oscillators
- Nonlinearities and Modelling
- MEMS/NEMS actuators
- Power MEMS
- Mechanical relays
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