New Approaches to Micropatterning, Volume II

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: closed (31 October 2021) | Viewed by 2437

Special Issue Editors


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Department of Chemistry and Chemical Biology, McMaster University, 1280 Main Street West, Hamilton, ON L8S 4M1, Canada
Interests: biomolecular patterning; micro/nanostructured materials; nanocellulose; surface chemistry; analytical chemistry
Laboratory for the Analysis and Architecture of Systems, Centre National de la Recherche Scientifique, 7 avenue du Colonel Roche, 31070 Toulouse, France
Interests: biomolecular patterning; directed assembly; soft-lithography; circulating biomarkers: oncology; additive manufacturing; micro/nanotechnologies
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Special Issue Information

Dear Colleagues,

Micropatterning allows the targeted spatial modification of bulk, surface, or interfacial properties at the micron to nanoscale. Micropatterning approaches have been used in the past to develop functional sensing devices, smart coatings, and biomolecular patterns, among many other structured materials. These have been used, for example, in microfluidic or portable point of care devices, self-cleaning surfaces, or tissue engineering applications. The advent of new micropatterning techniques, such as those based on additive manufacturing or microfluidics, and new materials, has opened the door to the development of even more complex functional materials and devices. In this Special Issue, we focus on new developments in micropatterning approaches, such as micropatterning within microfluidic devices, multiplexed micropatterning, patterning in three-dimensional structures, as well as new chemistries and materials, and the applications derived from them. We invite original research contributions, short communications, and in-depth reviews from early career and established researchers. The goal of this Special Issue is to capture the state-of-the-art in micropatterning techniques and the wide range of applications that these technologies can be deployed in. We look forward to and welcome your contributions to this Special Issue.

Prof. Dr. Jose Moran-Mirabal
Dr. Aline Cerf
Guest Editors

Manuscript Submission Information

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Keywords

  • Micro/nanopatterning
  • Biomolecular/cellular patterning
  • Micro/nanostructured materials
  • Functional materials
  • Microfluidics
  • Multiplexing
  • Sensors/devices
  • 3D architectures

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Published Papers (1 paper)

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Research

13 pages, 4872 KiB  
Article
Theoretical and Experimental Study on Hot-Embossing of Glass-Microprism Array without Online Cooling Process
by Manfeng Hu, Jin Xie, Wei Li and Yuanhang Niu
Micromachines 2020, 11(11), 984; https://doi.org/10.3390/mi11110984 - 31 Oct 2020
Cited by 8 | Viewed by 2050
Abstract
Optical glass-microprism arrays are generally embossed at high temperatures, so an online cooling process is needed to remove thermal stress, but this make the cycle long and its equipment expensive. Therefore, the hot-embossing of a glass-microprism array at a low strain rate with [...] Read more.
Optical glass-microprism arrays are generally embossed at high temperatures, so an online cooling process is needed to remove thermal stress, but this make the cycle long and its equipment expensive. Therefore, the hot-embossing of a glass-microprism array at a low strain rate with reasonable embossing parameters was studied, aiming at reducing thermal stress and realizing its rapid microforming without online cooling process. First, the flow-field, strain-rate, and deformation behavior of glass microforming were simulated. Then, the low-cost microforming control device was designed, and the silicon carbide (SiC) die-core microgroove array was microground by the grinding-wheel microtip. Lastly, the effect of the process parameters on forming rate was studied. Results showed that the appropriate embossing parameters led to a low strain rate; then, the trapezoidal glass-microprism array could be formed without an online cooling process. The standard deviation of the theoretical and experimental forming rates was only 7%, and forming rate increased with increasing embossing temperature, embossing force, and holding duration, but cracks and adhesion occurred at a high embossing temperature and embossing force. The highest experimental forming rate reached 66.56% with embossing temperature of 630 °C, embossing force of 0.335 N, and holding duration of 12 min. Full article
(This article belongs to the Special Issue New Approaches to Micropatterning, Volume II)
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