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Micromachines
Special Issues
Novel Devices and Advances in MEMS Fabrication Processes
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Novel Devices and Advances in MEMS Fabrication Processes

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: closed (31 March 2023) | Viewed by 14581

Special Issue Editors

Dr. Margarita Tecpoyotl-Torres

E-Mail Website
Guest Editor
Centro de Investigación en Ingeniería y Ciencias Aplicadas, de la Universidad Autónoma del Estado de Morelos, Avenida Universidad 1001, Chamilpa, Cuernavaca 62209, México
Interests: microelectromechanical systems; microactuators; compliance mechanisms; antenna design; innovation management; development of educational programs
Special Issues, Collections and Topics in MDPI journals
Dr. Jesus J. Alcantar Peña

E-Mail Website1 Website2
Guest Editor
Centro de Ingeniería y Desarrollo Industrial (CIDESI). Av. Playa pie de la cuesta 702, Desarrollo San Pablo, Querétaro 76125, Mexico,
Interests: design of products implementing emerging sensors in medical applications; CMUT; microneedling; pressure sensors; gas sensors; flow sensors; bio-sensors; commercialization of technology
Special Issues, Collections and Topics in MDPI journals
Dr. Sanchez Mondragon

E-Mail Website
Guest Editor
Instituto Nacional de Astrofísica, Óptica y Electrónica, INAOE, Luis Enrique Erro No. 1, C.P. 72840, Tonantzintla, Puebla, Mexico
Interests: photonics; quantum optics; microphotonics beam propagation; educational programs development

Special Issue Information

Dear Colleagues,

MEMS devices have endless advantages over macrodevices and traditional electromechanical devices, with sizes ranging from micrometers to millimeters. MEMS devices are generally produced by implementing micromachining techniques inherited from the integrated circuit industry of silicon technology. From the inception of microelectromechanical systems (MEMS), multiple devices have been developed. Some have passed the development stage and reached commercialization; the first MEMS devices were commercialized in early 1980, when MEMS pressure sensors and accelerometers were widely applied in the automotive industry, and in 1995, the possibility of miniaturization of the chemical analysis was introduced. MEMS devices have achieved significant advances in multiple areas that have a positive impact on social welfare as well as environmental care. However, challenges remain in the limits of the technology’s application, as well as in the manufacturing processes that make them a reality. Accordingly, this Special Issue seeks to showcase research papers, communications, and review articles that focus on: (1) designs and modeling of novel MEMS devices; (2) new developments in applying MEMS devices in current, and emergent areas; and (3) advances in MEMS fabrication processes.

We look forward to receiving your submissions! 

Dr. Margarita Tecpoyotl-Torres
Dr. Jesus J. Alcantar Peña
Dr. Sanchez Mondragon
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS sensors
  • MEMS actuators
  • BioMEMS
  • medical MEMS
  • microfluidic devices
  • PiezoMEMS
  • MEMS-based electronic systems
  • MEMS fabrication processes

Published Papers (7 papers)

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Research

Jump to: Review

25 pages, 12510 KiB  
Article
Additive Manufactured Piezoelectric-Driven Miniature Gripper
by C. Andres Ferrara-Bello, Margarita Tecpoyotl-Torres and S. Fernanda Rodriguez-Fuentes
Micromachines 2023, 14(4), 727; https://doi.org/10.3390/mi14040727 - 25 Mar 2023
Viewed by 1526
Abstract
In several cases, it is desirable to have prototypes of low-cost fabrication and adequate performance. In academic laboratories and industries, miniature and microgrippers can be very useful for observations and the analysis of small objects. Piezoelectrically actuated microgrippers, commonly fabricated with aluminum, and [...] Read more.
In several cases, it is desirable to have prototypes of low-cost fabrication and adequate performance. In academic laboratories and industries, miniature and microgrippers can be very useful for observations and the analysis of small objects. Piezoelectrically actuated microgrippers, commonly fabricated with aluminum, and with micrometer stroke or displacement, have been considered as Microelectromechanical Systems (MEMS). Recently, additive manufacture using several polymers has also been used for the fabrication of miniature grippers. This work focuses on the design of a piezoelectric-driven miniature gripper, additive manufactured with polylactic acid (PLA), which was modeled using a pseudo rigid body model (PRBM). It was also numerically and experimentally characterized with an acceptable level of approximation. The piezoelectric stack is composed of widely available buzzers. The aperture between the jaws allows it to hold objects with diameters lower than 500 μm, and weights lower than 1.4 g, such as the strands of some plants, salt grains, metal wires, etc. The novelty of this work is given by the miniature gripper’s simple design, as well as the low-cost of the materials and the fabrication process used. In addition, the initial aperture of the jaws can be adjusted, by adhering the metal tips in the required position. Full article
(This article belongs to the Special Issue Novel Devices and Advances in MEMS Fabrication Processes)
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20 pages, 6006 KiB  
Article
Novel Electrothermal Microgrippers Based on a Rotary Actuator System
by Pedro Vargas-Chable, Margarita Tecpoyotl-Torres, Gerardo Vera-Dimas, Volodymyr Grimalsky and José Mireles García, Jr.
Micromachines 2022, 13(12), 2189; https://doi.org/10.3390/mi13122189 - 10 Dec 2022
Cited by 1 | Viewed by 1239
Abstract
Microgrippers are devices that have found applications in various fields of research and industry. They are driven by various actuation methods. In this article, an electrothermal rotary actuator recently proposed in the literature is explored to obtain a novel microgripper design (Model 1). [...] Read more.
Microgrippers are devices that have found applications in various fields of research and industry. They are driven by various actuation methods. In this article, an electrothermal rotary actuator recently proposed in the literature is explored to obtain a novel microgripper design (Model 1). In addition, the use of the rotary actuator as part of the chevron actuated microgrippers (Model 2) is also discussed. The theoretical analysis of the rotary actuator is supported by an equivalent U-shaped-like microactuator. The small error values validate the approximation used. Numerical modeling is performed with ANSYSTM (Student version 2022, ANSYS, PA, USA). A comparison of theoretical and numerical results provides acceptable error values. The total inter-jaw displacement values obtained for models 1 and 2 are 12.28 μm and 21.2 μm, respectively, and the reaction force is 8.96 μN and 34.2 μN, respectively. The performance parameters of both microgrippers could make their use feasible for different nanoapplications. Model 2 can be used when higher force and displacement are required. Full article
(This article belongs to the Special Issue Novel Devices and Advances in MEMS Fabrication Processes)
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29 pages, 15434 KiB  
Article
Optical Sensor, Based on an Accelerometer, for Low-Frequency Mechanical Vibrations
by Rodolfo Sánchez-Fraga, Margarita Tecpoyotl-Torres, Israel Mejía, Jorge Omar Mañón, Luis Eduardo Riestra and Jesús Alcantar-Peña
Micromachines 2022, 13(9), 1462; https://doi.org/10.3390/mi13091462 - 3 Sep 2022
Cited by 1 | Viewed by 2241
Abstract
This article documents the design, manufacture, and testing of a silicon inertial optical sensor for low-frequency (lower than 2 kHz) applications. Three accelerometer designs optimized by parameterization using Finite Element Analysis were considered. The accelerometers were manufactured and the one with the highest [...] Read more.
This article documents the design, manufacture, and testing of a silicon inertial optical sensor for low-frequency (lower than 2 kHz) applications. Three accelerometer designs optimized by parameterization using Finite Element Analysis were considered. The accelerometers were manufactured and the one with the highest performance at low frequency was chosen for testing, which was attached to a steel package. The feasibility of using probes, based on micro-machined sensing elements, to measure mechanical vibrations with high resolution was also studied. The detection is performed with an air interferometer, eliminating the need for electric signals that are susceptible to electromagnetic interference and large temperature variations. From the fabrication technology using only a silicon wafer with both sides etched, the frequency response of the sensor, temperature operation (higher than 85 °C) and with a resolution of 17.5 nm, it was concluded that is achievable and feasible to design and manufacture an optical vibration sensor for potential harsh environments with a low cost. Full article
(This article belongs to the Special Issue Novel Devices and Advances in MEMS Fabrication Processes)
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20 pages, 12746 KiB  
Article
Z-Shaped Electrothermal Microgripper Based on Novel Asymmetric Actuator
by Margarita Tecpoyotl-Torres, Pedro Vargas-Chable, Jesus Escobedo-Alatorre, Luis Cisneros-Villalobos and Josahandy Sarabia-Vergara
Micromachines 2022, 13(9), 1460; https://doi.org/10.3390/mi13091460 - 3 Sep 2022
Cited by 2 | Viewed by 1348
Abstract
Based on a V-shaped microactuator with a pair of beams, modifications were made to the length and width of a microactuator to observe the effects. A theoretical approach and numerical characterization of the modified microactuator were performed. Its performance was compared to a [...] Read more.
Based on a V-shaped microactuator with a pair of beams, modifications were made to the length and width of a microactuator to observe the effects. A theoretical approach and numerical characterization of the modified microactuator were performed. Its performance was compared to a similar microactuator with equal beam widths, and a V-shaped microactuator. The proposed microactuator, fed at 2 V, compared to the V-shaped actuator, showed a 370.48% increase in force, but a 29.8% decrease in displacement. The equivalent von Mises stress level increased (until 74.2 MPa), but was below the silicon ultimate stress. When the modified microactuator was applied to the proposed microgripper, compared to the case using a V-shaped actuator, the displacement between the jaws increased from 0.85 µm to 4.85 µm, the force from 42.11 mN to 73.61 mN, and the natural frequency from 11.36 kHz to 37.99 kHz; although the temperature increased, on average, from 42 °C up to 73 °C, it is not a critical value for many microobjects. The maximum equivalent von Mises stress was equal to 68.65 MPa. Therefore, it has been demonstrated that the new modified microactuator with damping elements is useful for the proposed microgripper of novel geometry, while a reduced area is maintained. Full article
(This article belongs to the Special Issue Novel Devices and Advances in MEMS Fabrication Processes)
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15 pages, 3002 KiB  
Article
Electroplated Al Press Marking for Wafer-Level Bonding
by Muhammad Salman Al Farisi, Takashiro Tsukamoto and Shuji Tanaka
Micromachines 2022, 13(8), 1221; https://doi.org/10.3390/mi13081221 - 30 Jul 2022
Cited by 3 | Viewed by 1738
Abstract
Heterogeneous integration of micro-electro mechanical systems (MEMS) and complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking or wafer bonding is an emerging approach to advance the functionality of microdevices. Aluminum (Al) has been of interest as one of the wafer [...] Read more.
Heterogeneous integration of micro-electro mechanical systems (MEMS) and complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking or wafer bonding is an emerging approach to advance the functionality of microdevices. Aluminum (Al) has been of interest as one of the wafer bonding materials due to its low cost and compatibility with CMOS processes. However, Al wafer bonding typically requires a high temperature of 450 °C or more due to the stable native oxide which presents on the Al surface. In this study, a wafer bonding technique for heterogeneous integration using electroplated Al bonding frame is demonstrated. The bonding mechanism relies on the mechanical deformation of the electroplated Al bonding frame through a localized bonding pressure by the groove structures on the counter wafer, i.e., press marking. The native oxide on the surface was removed and a fresh Al surface at the bonding interface was released through such a large mechanical deformation. The wafer bonding was demonstrated at the bonding temperatures of 250–450 °C. The influence of the bonding temperature to the quality of the bonded substrates was investigated. The bonding shear strength of 8–100 MPa was obtained, which is comparable with the other Al bonding techniques requiring high bonding temperature. Full article
(This article belongs to the Special Issue Novel Devices and Advances in MEMS Fabrication Processes)
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21 pages, 712 KiB  
Article
Investigation into Mode Localization of Electrostatically Coupled Shallow Microbeams for Potential Sensing Applications
by Ayman M. Alneamy and Hassen M. Ouakad
Micromachines 2022, 13(7), 989; https://doi.org/10.3390/mi13070989 - 24 Jun 2022
Cited by 6 | Viewed by 1711
Abstract
With the constant need for the development of smart devices, Micro-Electro-Mechanical Systems (MEMS) based smart sensors have been developed to detect hazard materials, micro-particles or even toxic substances. Identifying small particles using such micro-engineering technology requires designing sensors with high sensitivity, selectivity and [...] Read more.
With the constant need for the development of smart devices, Micro-Electro-Mechanical Systems (MEMS) based smart sensors have been developed to detect hazard materials, micro-particles or even toxic substances. Identifying small particles using such micro-engineering technology requires designing sensors with high sensitivity, selectivity and ease of integration with other electronic components. Nevertheless, the available detection mechanism designs are still juvenile and need more innovative ideas to be even more competitive. Therefore, this work aims to introduce a novel, smart and innovative micro-sensor design consisting of two weakly electrostatically coupled microbeams (both serving as sensors) and electrically excited using a stationary electrode assuming a dc/ac electric signal. The sensor design can be tuned from straight to eventually initially curved microbeams. Such an arrangement would develop certain nonlinear phenomena, such as the snap-through motion. This behavior would portray certain mode veering/mode crossing and ultimately mode localization and it would certainly lead in increasing the sensitivity of the mode-localized based sensing mechanism. These can be achieved by tracking the change in the resonance frequencies of the two microbeams as the coupling control parameter is varied. To this extent, a nonlinear model of the design is presented, and then a reduced-order model considering all geometric and electrical nonlinearities is established. A Long-Time Integration (LTI) method is utilized to solve the static and dynamics of the coupled resonators under primary lower-order and higher-order resonances, respectively. It is shown that the system can display veering and mode coupling in the vicinity of the primary resonances of both beams. Such detected modal interactions lead to an increase in the sensitivity of the sensor design. In addition, the use of two different beam’s configurations in one device uncovered a possibility of using this design in detecting two potential substances at the same time using the two interacting resonant peaks. Full article
(This article belongs to the Special Issue Novel Devices and Advances in MEMS Fabrication Processes)
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Review

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31 pages, 4256 KiB  
Review
Micromachined Thermal Time-of-Flight Flow Sensors and Their Applications
by Liji Huang
Micromachines 2022, 13(10), 1729; https://doi.org/10.3390/mi13101729 - 13 Oct 2022
Viewed by 2759
Abstract
Micromachined thermal flow sensors on the market are primarily manufactured with the calorimetric sensing principle. The success has been in limited industries such as automotive, medical, and gas process control. Applications in some emerging and abrupt applications are hindered due to technical challenges. [...] Read more.
Micromachined thermal flow sensors on the market are primarily manufactured with the calorimetric sensing principle. The success has been in limited industries such as automotive, medical, and gas process control. Applications in some emerging and abrupt applications are hindered due to technical challenges. This paper reviews the current progress with micromachined devices based on the less popular thermal time-of-flight sensing technology: its theory, design of the micromachining process, control schemes, and applications. Thermal time-of-flight sensing could effectively solve some key technical hurdles that the calorimetric sensing approach has. It also offers fluidic property-independent data acquisition, multiparameter measurement, and the possibility for self-calibration. This technology may have a significant perspective on future development. Full article
(This article belongs to the Special Issue Novel Devices and Advances in MEMS Fabrication Processes)
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