Advances in Diamond-Based Devices and Their Manufacturing
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: closed (15 July 2023) | Viewed by 2988
Special Issue Editor
Special Issue Information
Dear Colleagues,
As the commercially viable methods for synthesizing diamond grow rapidly, diamond-based devices have attracted considerable interest in recent years as possible alternatives for high-power, high-frequency applications due to their unique material properties, such as high stiffness, outstanding thermal conductivity, ultrawide bandgap, ultrahigh dielectric breakdown field, high electron and hole mobilities, etc. Several challenges remain, including the manufacture of high-quality wafer-scale diamond substrates, effective n-type doping in diamond semiconductors, and the improvement of device processing efficiency, although we have made some progress in diamond-based Schottky barrier diodes, metal–semiconductor field–effect transistors (MESFETs), metal–oxide–semiconductor FETs, etc. Accordingly, this Special Issue seeks to showcase research papers, letters, and review articles that focus on advances in manufacturing diamond-based structures in microelectronics, optoelectronics, and quantum information technologies.
We have the pleasure to invite you to submit your research articles on new diamond-based device structures, high-quality diamond synthesis, diamond-based devices with improved performance, and the device preparation process to our special issue "Advances in Diamond-Based Devices and Their Manufacturing." We look forward to receiving your submissions.
Dr. Chaoqun Dang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- diamond-based device
- ultra-wide bandgap semiconductor
- micro/nanofabrication
- device performance
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