Photonic Chips for Optical Communications
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (30 January 2022) | Viewed by 38778
Special Issue Editors
Interests: integrated optics; nonlinear optics; silicon photonics; III-V photonics; nanofabrication; heterogeneous integration; frequency combs; optical signal processing
Interests: all optical signal processing; integrated nonlinear optics; optical parametric processes; mode division multiplexing techniques; general coupled mode theory
Special Issue Information
Dear colleagues,
The rapid growth of data traffic in optical communications (data center interconnects, long-haul transmission, metro/access networks, etc.) requires low-cost and energy-efficient solutions. The development of integrated photonic components is essential to meet these requirements as it offers significant advantage in terms of footprint, efficiency, robustness, reconfigurability, etc. In the last decade, as silicon photonics became a mature technology, significant efforts have also been put into developing different material platforms for passive, active, and nonlinear devices. The development of hybrid integration technology enables the combination of superior properties from different platforms on a single optical chip that offers low-cost and energy-efficient solutions. Steadily performance improvements and system innovations have also been witnessed because of the significant progress in new structures/concepts such as subwavelength components, metasurfaces, topological photonics, machine learning and artificial Intelligence.
This special issue focuses on the latest advancement of integrated photonic components such as lasers, modulators, semiconductor optical amplifiers, nonlinear devices, detectors, and fiber-to-chip couplers, which play essential roles in optical communication. The topics include but are not limited to the design, fabrication, characterization of the integrated photonic components and their applications for different multiplexing technologies (WDM, SDM, MDM), optical signal processing, quantum information processing, optical interconnects, data centers, optical access networks.
Dr. Minhao Pu
Dr. Jing Xu
Guest Editors
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Keywords
- Integrated photonic components
- Modulators
- Semiconductor optical amplifiers
- Nonlinear devices
- Detectors
- Fiber-to-chip couplers
- Optical signal processing
- Optical communication
- Quantum information processing
- Optical interconnects
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