SiC Based Miniaturized Devices, 3rd Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 20 February 2025 | Viewed by 63
Special Issue Editors
Interests: SiC; neural interfaces; SiC MEMS; biotechnology
Special Issues, Collections and Topics in MDPI journals
Interests: SiC; SiC MEMS
Special Issue Information
Dear Colleagues,
MEMS devices are found in many of today’s electronic devices and systems, from airbag sensors in cars to smart phones, embedded systems, etc. Increasingly, the reduction in dimensions has led to nanometer-scale devices, called NEMS. The plethora of applications on the commercial market speaks for itself, especially for the highly precise manufacturing of silicon-based MEMS and NEMS. While this is a tremendous achievement, silicon as a material comes with some drawbacks, mainly in terms of its mechanical fatigue and thermal properties. Silicon carbide (SiC) is a well-known wide-bandgap semiconductor, the adoption of which in commercial products is experiencing exponential growth, especially in the power electronics arena. While SiC MEMS have been around for decades, in this Special Issue, we seek to both present an overview of the devices that have been demonstrated to date and bring new technologies and points of progress in the MEMS processing field to the forefront. Thus, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on the following: (1) novel designs, fabrication, control, and modeling of SiC MEMS and NEMS based on all kinds of actuation mechanisms; (2) new developments in applying SiC MEMS and NEMS in consumer electronics, optical communications, industry, medicine, agriculture, space, and defense.
Prof. Dr. Stephen Edward Saddow
Dr. Brenda L. VanMil
Dr. Benoit Hamelin
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- SiC microsystems
- SiC MEMS
- SiC biomedical devices
- SiC micromachines
- SiC microsensors
Related Special Issues
- SiC based Miniaturized Devices in Micromachines (11 articles)
- SiC Based Miniaturized Devices, Volume II in Micromachines (3 articles)
