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Open AccessEditorial

Editorial for Future Trends in Ultra-Precision Machining

by Changlin Liu, Yanbin Zhang and Xiaoliang Liang

Micromachines 2026, 17(4), 422; https://doi.org/10.3390/mi17040422 - 30 Mar 2026

Viewed by 373

Abstract

Ultra-precision machining (UPM) is an advanced manufacturing technology used to produce components with exceptionally high dimensional accuracy, surface integrity, and form precision [...] Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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Research

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17 pages, 3204 KB

Open AccessArticle

A Transferable Digital Twin-Driven Process Design Framework for High-Performance Multi-Jet Polishing

by Honglei Mo, Xie Chen, Lingxi Guo, Zili Zhang, Xiao Chen, Jianning Chu and Ruoxin Wang

Micromachines 2026, 17(2), 226; https://doi.org/10.3390/mi17020226 - 10 Feb 2026

Cited by 1 | Viewed by 482

Abstract

The multi-jet polishing process (MJP) demonstrates high shape accuracy and surface quality in the machining of nonlinear and complex surfaces, and it achieves precise and adjustable material removal rates through computer control. However, there are still challenges in terms of machining efficiency, system [...] Read more.

The multi-jet polishing process (MJP) demonstrates high shape accuracy and surface quality in the machining of nonlinear and complex surfaces, and it achieves precise and adjustable material removal rates through computer control. However, there are still challenges in terms of machining efficiency, system complexity, and stability. In particular, maintaining the polishing quality presents a greater challenge when working conditions change. To overcome these issues, this paper conceptually proposes a digital twin (DT)-driven, human-centric design framework that integrates key factors of MJP, such as jet kinetic energy, nozzle structure, abrasive type, and machining path. Within this framework, a feature-encoded transfer learning-based model is introduced to enhance surface roughness prediction accuracy and robustness under varying working conditions. The effectiveness of the proposed model was verified by conducting experiments on 3D printed workpieces under two different MJP working conditions. The results show that our proposed method yields better predictive performance and cross-condition adaptability. Overall, this work provides a predictive modeling component that supports DT-driven process design, offering a practical and extensible perspective for optimizing complex ultra-precision manufacturing processes under data-scarce and uncertainty-dominated conditions. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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14 pages, 1512 KB

Open AccessArticle

YOLO-LA: Prototype-Based Vision–Language Alignment for Silicon Wafer Defect Pattern Detection

by Ziyue Wang, Yichen Yang, Jianning Chu, Yikai Zang, Zhongdi She, Weikang Fang and Ruoxin Wang

Micromachines 2026, 17(1), 67; https://doi.org/10.3390/mi17010067 - 31 Dec 2025

Cited by 2 | Viewed by 1036

Abstract

With the rapid development of semiconductor manufacturing technology, methods to effectively control the production process, reduce variation in the manufacturing process, and improve the yield rate represent important competitive factors for wafer factories. Wafer bin maps, a method for characterizing wafer defect patterns, [...] Read more.

With the rapid development of semiconductor manufacturing technology, methods to effectively control the production process, reduce variation in the manufacturing process, and improve the yield rate represent important competitive factors for wafer factories. Wafer bin maps, a method for characterizing wafer defect patterns, provide valuable information for engineers to quickly identify potential root causes through accurate pattern recognition. Vision-based deep learning approaches rely on visual patterns to achieve robust performance. However, they rarely exploit the rich semantic information embedded in defect descriptions, limiting interpretability and generalization. To address this gap, we propose YOLO-LA, a lightweight prototype-based vision–language alignment framework that integrates a pretrained frozen YOLO backbone with a frozen text encoder to enhance wafer defect recognition. A learnable projection head is introduced to map visual features into a shared embedding space, enabling classification through cosine similarity Experimental results on the WM-811K dataset demonstrate that YOLO-LA consistently improves classification accuracy across different backbones while introducing minimal additional parameters. In particular, YOLOv12 achieves the fastest speed while maintaining competitive accuracy, whereas YOLOv10 benefits most from semantic prototype alignment. The proposed framework is lightweight and suitable for real-time industrial wafer inspection systems. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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15 pages, 6386 KB

Open AccessArticle

Investigation into Laser-Vibration-Assisted Cutting of Single-Crystal Silicon by Molecular Dynamics Simulation

by Jianning Chu, Yichen Yang, Yikai Zang, Jinyang Ke, Ziyue Wang, Chen Chen, Jifei He, Aijiang Xu and Zhongdi She

Micromachines 2025, 16(12), 1411; https://doi.org/10.3390/mi16121411 - 15 Dec 2025

Cited by 1 | Viewed by 621

Abstract

It is difficult to achieve ultra-precision machining (UPM) on semiconductor materials like single-crystal silicon because of their hardness and brittleness. To solve this issue, numerous field-assisted machining systems and their combinations have been suggested and developed. However, the difficulty in directly observing the [...] Read more.

It is difficult to achieve ultra-precision machining (UPM) on semiconductor materials like single-crystal silicon because of their hardness and brittleness. To solve this issue, numerous field-assisted machining systems and their combinations have been suggested and developed. However, the difficulty in directly observing the physical variables limits our comprehension of the in-depth machining mechanisms of field-assisted machining. In this work, we investigated the machining mechanism of single-crystal silicon under the combination of laser heating and tool vibration using molecular dynamics (MD) simulations. The effect of tool vibration trajectory determined by different tool edge radii is discussed under the condition of raising temperature. The simulation results indicate that the surface morphology is closely related to vibration and heating parameters. Raising the cutting temperature causes a reversed relation between tool edge radius and surface roughness. While the subsurface damage and internal stress are also determined by the tool edge radius and cutting temperature. The findings in this simulation could help to improve the understanding of machining mechanics in multi-field-assisted machining. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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20 pages, 1518 KB

Open AccessArticle

An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments

by Ziyue Wang, Weikang Fang and Yichen Yang

Micromachines 2025, 16(12), 1403; https://doi.org/10.3390/mi16121403 - 12 Dec 2025

Cited by 1 | Viewed by 504

Abstract

With the continuous development of semiconductor manufacturing technology and information technology, the sizes of wafer chips are becoming smaller and the variety is increasing, which has put forward high requirements for wafer chip precision manufacturing and packaging workshops. On the one hand, the [...] Read more.

With the continuous development of semiconductor manufacturing technology and information technology, the sizes of wafer chips are becoming smaller and the variety is increasing, which has put forward high requirements for wafer chip precision manufacturing and packaging workshops. On the one hand, the market demand for multiple varieties and small batches will increase the difficulty of scheduling. On the other hand, the complex manufacturing environment brings various types of dynamic events that will disrupt production plans. Accordingly, this work researches the wafer chip precision packaging workshop rescheduling problem under events of machine breakdown, emergency order inserting and original order modification. Firstly, the mathematical model for the addressed problem is established, and the rolling horizon technology is adopted to deal with multiple dynamic events. Then, a hybrid algorithm combining an improved firefly optimization framework and variable neighborhood search strategy is proposed. The population evolution mechanism is designed based on the location-updating law of fireflies in nature. The variable neighborhood search is applied for avoiding local optima and sufficiently exploring in the neighborhood. At last, the test results of comparative experiments and engineering cases indicate that the proposed method is effective and stable and is superior to the current advanced algorithms. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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21 pages, 7655 KB

Open AccessArticle

Enhancing the Machinability of Sapphire via Ion Implantation and Laser-Assisted Diamond Machining

by Jinyang Ke, Honglei Mo, Ke Ling, Jianning Chu, Xiao Chen and Jianfeng Xu

Micromachines 2025, 16(10), 1165; https://doi.org/10.3390/mi16101165 - 14 Oct 2025

Cited by 2 | Viewed by 1049

Abstract

Sapphire crystals, owing to their outstanding mechanical and optical properties, which are widely used in advanced optics, microelectronic devices, and medical instruments. The manufacturing precision of sapphire optical components critically affects the performance of advanced optical systems. However, the extremely high hardness and [...] Read more.

Sapphire crystals, owing to their outstanding mechanical and optical properties, which are widely used in advanced optics, microelectronic devices, and medical instruments. The manufacturing precision of sapphire optical components critically affects the performance of advanced optical systems. However, the extremely high hardness and low fracture toughness of sapphire make it a typical hard-to-machine material, prone to brittle surface fractures and subsurface damage during material removal. Improving the machinability of sapphire remains a pressing challenge in advanced manufacturing. In this study, surface modification and enhanced ductility of C-plane sapphire were achieved via ion implantation, and the machinability of the modified sapphire was further improved through laser-assisted diamond machining (LADM). Monte Carlo simulations were employed to investigate the interaction mechanisms between incident ions and the target material. Based on the simulation results, phosphorus ion implantation experiments were conducted, and transmission electron microscopy observation was used to characterize the microstructural evolution of the modified layer, while the optical properties of the samples before and after modification were analyzed. Finally, groove cutting experiments verified the enhancement in ductile machinability of the modified sapphire under LADM. At a laser power of 16 W, the ductile–brittle transition depth of the modified sapphire increased to 450.67 nm, representing a 51.57% improvement over conventional cutting. The findings of this study provide valuable insights for improving the ductile machining performance of hard and brittle materials. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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16 pages, 5065 KB

Open AccessArticle

Surface Integrity of Glass-Ceramics by Laser-Assisted Diamond Cutting

by Jiawei Li, Fang Ji and Feifei Xu

Micromachines 2025, 16(9), 1054; https://doi.org/10.3390/mi16091054 - 16 Sep 2025

Cited by 3 | Viewed by 1293

Abstract

Glass-ceramic optical components are extensively employed in advanced optical systems. The high-hardness and low-fracture toughness of glass-ceramics make it prone to cracks and subsurface damage during conventional cutting. The laser-assisted diamond cutting method can significantly improve the nano-cutting performance of glass-ceramics by locally [...] Read more.

Glass-ceramic optical components are extensively employed in advanced optical systems. The high-hardness and low-fracture toughness of glass-ceramics make it prone to cracks and subsurface damage during conventional cutting. The laser-assisted diamond cutting method can significantly improve the nano-cutting performance of glass-ceramics by locally heating and softening the material. However, its dynamic removal mechanisms remain unclear. The coupling mechanisms between the laser thermal field and the mechanical response of the material require further investigation. This study aims to reveal the dynamic removal mechanisms of glass-ceramics under laser-assisted nanoscale cutting conditions through numerical simulations and systematic experiments. It includes a systematic analysis of the effects of laser heating on chip morphology, temperature fields, stress fields, and cutting forces using a laser-assisted nano-cutting model. Additionally, through nanoscale taper cutting experiments, this study quantifies the enhancement effect of laser power on the critical depth of no observed surface cracks (NOSC). Finally, subsurface integrity results elucidate the mechanisms through which laser assistance inhibits crack propagation. The findings will provide theoretical support for optimizing laser-assisted cutting parameters and achieving high-quality machining of glass-ceramics. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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13 pages, 14630 KB

Open AccessArticle

Atomic Insight into the Nano-Grinding Mechanism of Reaction-Bonded Silicon Carbide: Effect of Abrasive Size

by Honglei Mo, Xie Chen, Cui Luo and Xiaojiang Cai

Micromachines 2025, 16(9), 1049; https://doi.org/10.3390/mi16091049 - 15 Sep 2025

Cited by 1 | Viewed by 1030

Abstract

Reaction-bonded silicon carbide (RB-SiC) is a high-performance ceramic material known for its excellent mechanical, thermal, and chemical properties. It contains phases with different mechanical properties, which introduce complex machining mechanisms. In the present work, molecular dynamics (MD) simulation was conducted to investigate the [...] Read more.

Reaction-bonded silicon carbide (RB-SiC) is a high-performance ceramic material known for its excellent mechanical, thermal, and chemical properties. It contains phases with different mechanical properties, which introduce complex machining mechanisms. In the present work, molecular dynamics (MD) simulation was conducted to investigate the effect of abrasive size on the nano-grinding mechanism of RB-SiC. The surface morphology and subsurface deformation mechanism were investigated. The simulation results suggest that when a small abrasive is used, the surface swelling of SiC is primarily generated by the bending and tearing of SiC at the interfaces. As the abrasive radius increases, the surface swelling is mainly formed by Si atoms, which is identified as elastic recovery. Meanwhile, the material removal rate gradually decreases, and the depth of plastic deformation is obviously increased. Stocking of Si is more apparent at the interface, and obvious sliding of SiC grains is observed, forming edge cracks at the margin of the workpiece. In the subsurface workpiece, the high-pressure phase transition (HPPT) of Si is promoted, and the squeeze of disordered Si is obvious with more dislocations formed when larger abrasive is used. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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Review

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28 pages, 10705 KB

Open AccessReview

A Review of the Machining Mechanisms in Field-Assisted Cutting of Brittle Materials

by Xuexiang Sheng, Zhanchen Zhu and Changlin Liu

Micromachines 2026, 17(3), 361; https://doi.org/10.3390/mi17030361 - 15 Mar 2026

Cited by 2 | Viewed by 616

Abstract

Brittle materials such as single crystals, polycrystalline ceramics, and amorphous glass are indispensable in modern industry. Driven by improvements in equipment performance, the required fabrication precision for optical elements and devices has reached nanoscale and is steadily advancing toward atomic level. Despite their [...] Read more.

Brittle materials such as single crystals, polycrystalline ceramics, and amorphous glass are indispensable in modern industry. Driven by improvements in equipment performance, the required fabrication precision for optical elements and devices has reached nanoscale and is steadily advancing toward atomic level. Despite their outstanding physical and chemical properties, fabricating a defect-free surface with nanometer-level roughness on brittle materials is challenging due to microcracking, brittle fracture and severe tool wear. In recent years, field-assisted cutting has emerged to overcome the bottleneck in ultra-precision cutting of brittle materials. This review summarizes investigations of material removal mechanisms of brittle materials in ultra-precision cutting and surveys representative field-assisted cutting technologies—including laser, vibration, magnetic field, and ion implantation assisted cutting—highlighting how these fields broaden ductile-regime machining and suppress the machining-induced defects. This review further discusses the emerging multi-field coupling strategies and outlines future research directions in machining mechanisms to enable high-efficiency, low-damage, and high-consistency manufacturing of brittle materials. Full article

(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining)

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