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Development of Food Packaging Materials

A special issue of Molecules (ISSN 1420-3049). This special issue belongs to the section "Food Chemistry".

Deadline for manuscript submissions: 30 June 2025 | Viewed by 47

Special Issue Editors


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Guest Editor
Department of Analytical Chemistry, Nutrition & Food Sciences, University of Alicante, San Vicente del Raspeig, ES-03690 Alicante, Spain
Interests: innovative biodegradable polymers; valorisation of agro-food wastes and by-products; encapsulation systems for bioactive compounds; food active packaging; natural antioxidants/antimicrobials; sustainable extraction methods
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Food packaging is an integral part of the modern food industry, as most food commodities reach the consumer in the form of packaged products. The initial objectives of packaging were to contain, protect, and provide convenience and communication to the consumer. With time, packaging has evolved to include interaction of the package with the contained food product to better preserve product freshness/quality and safety as consumers prefer fresh or lightly processed foodstuffs with increased shelf life. The main packaging materials intended to come in direct contact with foodstuffs include plastics, paper and paperboard, glass, and metals. Another aspect of primary importance in packaging is the extent to which waste coming from packaging materials affects the environment. Thus, contemporary packaging materials should be recyclable in order to reduce environmental pollution. The present Special Issue will focus on scientific and technological innovations in food packaging materials and packaging technologies with the purpose to better preserve the quality and safety of the contained food product while better protecting the environment. Examples of such advances in materials and processes include barrier materials, recyclable materials, active and intelligent materials, biodegradable materials, nanomaterials in packaging, adhesives, and printing materials, as well as the respective processes such as coating, dyeing, printing, recycling, modified atmosphere packaging, active packaging, intelligent packaging, aseptic packaging, irradiation, etc. Submissions of manuscripts from all related fields are welcome.

Prof. Dr. Michael Kontominas
Prof. Dr. María Carmen Garrigós
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Molecules is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • plastics, glass, metals, paper/paperboard
  • biodegradable materials
  • recyclable materials
  • active and Intelligent materials
  • nanomaterials in packaging

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Published Papers

This special issue is now open for submission.
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