Metal Material, Coating and Electrochemistry Technology

A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Materials Processes".

Deadline for manuscript submissions: 15 May 2025 | Viewed by 26

Special Issue Editors


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Guest Editor
School of Materials, Sun Yat-Sen University, Shenzhen 518107, China
Interests: simulation and aided design; topology structure of metals/electrolyte interfacial; functional coatings

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Guest Editor
1. School of Materials, Sun Yat-Sen University, Shenzhen 518107, China
2. School of Energy and Environment, City University of Hong Kong, Kowloon Tong, Hong Kong, China
Interests: advanced electrochemical technology; photophysical chemistry

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Guest Editor
Faculty of Mechanical Engineering & Mechanics, Ningbo University, Ningbo 315211, China
Interests: finite element simulation calculation of material corrosion behavior; development of corrosion-resistant protective coatings; research on the mechanism of corrosion behavior

Special Issue Information

Dear Colleagues,

The research on metallic materials is a broad and constantly evolving field, encompassing multiple subfields ranging from basic science to applied technology. The innovative design of metals/alloys involves developing new metal/alloy systems, improving the properties of existing metals/alloys, and exploring the relationship between the microstructures of metal materials and their macroscopic properties.

This Special Issue will specifically introduce, but is not limited to, both theoretical calculations and experimental techniques and/or applications in the following areas: microstructures and properties, the simulation and aided design of materials, metal/electrolyte interfacial topology structure-influenced reaction, innovative applications of metals and alloys, surface treatment and coating, advanced electrochemistry technology, rare earth functional materials, preparation and processing technologies for special alloys, and new processes for material preparation. These research directions not only promote the development of metal materials themselves but also improve related industrial technologies and the application of new materials in various fields.

Dr. Xianze Meng
Dr. Xinran Li
Dr. Qinhao Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • metals and alloys
  • surface treatment
  • gradient nanocrystallization
  • electrochemical testing technology
  • electric double layer
  • corrosion and protection
  • coating design and performance
  • electrochemical reaction
  • computer aided design
  • theoretical calculation

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Published Papers

This special issue is now open for submission.
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