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Microwave/MM-Wave Components for Communications and Sensors
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Microwave/MM-Wave Components for Communications and Sensors

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Nanosensors".

Deadline for manuscript submissions: 25 November 2024 | Viewed by 625

Special Issue Editors

Prof. Dr. Kang Wook Kim

E-Mail Website
Guest Editor
School of Electronic and Electrical Engineering, Kyungpook National University, Daegu 41566, Republic of Korea
Interests: super-high-speed digital data transmission; ultra-wideband microwave components and modules; microwave/mm-wave packaging; personal communication antennas; microwave/mm-wave plasma diagnostics
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Sachin Kumar

E-Mail Website
Guest Editor
Department of Electronics and Communication Engineering, Galgotias College of Engineering and Technology, Greater Noida 201310, India
Interests: 6G; biomedical devices; microwave/mm-wave antennas; rectenna; RF sensors; wearable/flexible electronics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue focuses on emerging technologies using microwave and mm-wave components for communications and sensors. In the midst of the fourth industrial revolution, advanced technologies like 5G/6G communications, the Internet of Things (IoT), and artificial intelligence, based on cloud computing and high-performance computing, have revolutionized information technology. This revolution necessitates a huge volume of digital data transmission on a fast time scale. Modern digital circuits often reach data rates in the tens of Gbps, and a high-speed digital signal, composed of the fundamental frequency and its harmonics, tends to occupy a very wide bandwidth, extending up to mm-wave frequencies. Microwave and mm-wave components are also used for various sensor and diagnostic applications. Therefore, this Special Issue will cover various emerging research topics on microwave and mm-wave technologies for communications and sensors.

Prof. Dr. Kang Wook Kim
Prof. Dr. Sachin Kumar
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microwave components and instrumentation
  • microwave components for high-speed digital data transmission
  • microwave and mm-wave antennas
  • microwave and mm-wave sensors
  • broadband/ultra-wideband microwave components
  • high-resolution radars and radiometers
  • microwave and mm-wave diagnostics

Published Papers (1 paper)

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Research

14 pages, 3986 KiB  
Article
Ultra-Wideband Vertical Transition in Coplanar Stripline for Ultra-High-Speed Digital Interfaces
by Mun-Ju Kim, Jung-Seok Lee, Byung-Cheol Min, Jeong-Sik Choi, Sachin Kumar, Hyun-Chul Choi and Kang-Wook Kim
Sensors 2024, 24(10), 3233; https://doi.org/10.3390/s24103233 - 19 May 2024
Viewed by 500
Abstract
A design method for an ultra-wideband coplanar-stripline-based vertical transition that can be used for ultra-high-speed digital interfaces is proposed. A conventional via structure, based on a differential line (DL), inherently possesses performance limitations (<10 GHz) due to difficulties in maintaining constant line impedance [...] Read more.
A design method for an ultra-wideband coplanar-stripline-based vertical transition that can be used for ultra-high-speed digital interfaces is proposed. A conventional via structure, based on a differential line (DL), inherently possesses performance limitations (<10 GHz) due to difficulties in maintaining constant line impedance and smooth electric field transformation, in addition to the effects of signal skews, FR4 fiber weave, and unbalanced EM interferences. DL-based digital interfaces may not meet the demands of ultra-high-speed digital data transmission required for the upcoming 6G communications. The use of a coplanar stripline (CPS), a type of planar balanced line (BL), for the vertical transition, along with the ultra-wideband DL-to-CPS transition, mostly removes the inherent and unfavorable issues of the DL and enables ultra-high-speed digital data transmission. The design process of the transition is simplified using the analytical design formulas, derived using the conformal mapping method, of the transition. The characteristic line impedances of the transition are calculated and found to be in close agreement with the results obtained from EM simulations. Utilizing these results, the CPS-based vertical transition, maintaining the characteristic line impedance of 100 Ω, is designed and fabricated. The measured results confirm its ultra-wideband characteristics, with a maximum of 1.6 dB insertion loss and more than 10 dB return loss in the frequency range of DC to 30 GHz. Therefore, the proposed CPS-based vertical transition offers a significantly wider frequency bandwidth, i.e., more than three times that of conventional DL-based via structures. Full article
(This article belongs to the Special Issue Microwave/MM-Wave Components for Communications and Sensors)
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