Microwave Components for Wireless Sensor and Instrumentation Applications
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".
Deadline for manuscript submissions: closed (31 October 2023) | Viewed by 4764
Special Issue Editor
Interests: super-high-speed digital data transmission; ultra-wideband microwave components and modules; microwave/mm-wave packaging; personal communication antennas; microwave/mm-wave plasma diagnostics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue is dedicated to emerging new technologies using microwave components and systems for wireless sensing and its instrumentation. Today, in the middle of the fourth industrial revolution, advanced technologies such as 5G communications, the Internet of Things (IoT), and artificial intelligence, based on cloud computing and a high-performance computing, have revolutionized the technology, which demands the transmission of a huge volume of digital data in a fast time scale. High-speed digital signals already contain significant high-frequency spectra spreading on microwave/mm-wave frequencies. Therefore, recently, new microwave/mm-wave technologies for wireless sensors and communications have emerged, and these topics will be covered in this Special Issue.
Prof. Dr. Kang Wook Kim
Guest Editor
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Keywords
- microwave components and instrumentation
- microwave/mm-wave antennas
- microwave/mm-wave sensors
- broadband/ultra-wideband microwave components
- high-resolution radars and radiometers
- microwave/mm-wave wireless diagnostics
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