Topical Advisory Panel Members' Collection Series: Advanced Electronic Materials and Their Sensing Applications
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".
Deadline for manuscript submissions: closed (30 May 2024) | Viewed by 4608
Special Issue Editors
Interests: SiC devices; Schottky diode; MOS capacitor; temperature sensors; gas sensors; microfabrication techniques; electrical characterization; data processing; interface characterization
Special Issues, Collections and Topics in MDPI journals
Interests: electrical characterization of semiconductor devices; wide-band-gap semiconductor devices and sensors; low-power neural network for in-sensor implementation; VLSI circuits
Special Issue Information
Dear Colleagues,
To celebrate the latest achievements of the journal, this Special Issue is now compiling a collection of feature papers invited by the Section Topical Advisory Panel Members and submitted by outstanding scholars in this research field. The scope of the call encompasses a wide array of sensor types, with a clear focus on emerging materials, the extended capabilities of derived sensing elements and their applications. Points of special interest include wide-band-gap semiconductor sensors, materials and coatings for electrochemical sensors, innovative sensing element structures (porous Si/SiC, Si/SiC nanowires), MEMS sensors (pressure and inertial sensors, microphones, etc.), read-out circuits and sensor-signal processing techniques. New advanced materials, such as covalent organic frameworks (COFs), can be considered for substrate functionalization in the context of electronic property enhancement. These are a class of crystalline and porous polymers, in which periodic building units are able to form pores of a controllable size. Investigations and predictions on operation limits, characterization and cutting-edge computer-aided modelling for such innovative devices are strongly encouraged. New materials and processes can also be considered for MEMS sensors: membrane topologies and materials, multi-stacked layers, for example, as well as the effects of environmentally induced stress on their behavior (temperature, pressure, etc.). The improvement of the signal-to-noise ratio requires a holistic approach, also involving the surrounding electronics. Therefore, new read-out circuits and signal processing techniques based on artificial intelligence (AI) will also be taken into consideration, enabling signal filtering, monitoring and correction of the sensor parameters, as well as edge applications. Points of special interest include the design of in-sensor or in-package AI accelerators, built with very compact and low-power circuital solutions to be closed coupled with the sensor circuitry or embedded in the same sensor package.
We invite you to submit the most advanced results in:
- Sensors on wide-band-gap semiconductors for high-temperature operation;
- Sensor modelling over large operation domains;
- Computer optimization for wide-range sensor parameterization;
- Electrochemical sensors using advanced materials, such as COFs;
- MEMS sensors technology;
- SNR improvement techniques;
- Artificial intelligence signal processing techniques;
- Low-power AI accelerators for near/in-sensors applications;
- New techniques for signal conditioning embedded into the read-out circuitry of the sensors.
Dr. Razvan Pascu
Dr. Gian Domenico Licciardo
Guest Editors
Manuscript Submission Information
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Keywords
- wide-band-gap semiconductors
- wide-range temperature sensors
- sensor modelling
- optimization computing
- wide operation range
- electrochemical sensors
- MEMS sensors
- artificial intelligence
- in-sensor circuit
- in-package sensor circuits
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