Reliability Metrology, Testing and Failure Analysis of Semiconductor Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".
Deadline for manuscript submissions: 30 December 2025 | Viewed by 95
Special Issue Editor
Interests: micromachining; nanofabrication; 3D integration; CMOS-MEMS stacking; advanced packaging
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Semiconductor devices such as CMOS, MEMS, sensors and actuators are essential for human beings, as they are widely used in our daily lives. With the development of technology, people are increasingly concerned about the quality and performance of semiconductor devices. There are some indicators that are used to assess the quality and performance of the devices. Reliability is one of the most important quality indicators and is affected by many factors, such as working conditions, temperature, pressure, electromigration, fatigue, vibration, lifetime, etc. There are many metrologies and approaches to characterize, test and identify the failure of semiconductor devices.
This Special Issue provides a platform for scholars to showcase their work in the field of semiconductor device reliability testing, failure analysis and metrology. The focus is primarily on metrology methods, characterization, testing and failure analysis related to the reliability of semiconductor devices. We encourage the submission of research highlighting recent progress and achievements in the characterization and failure analysis of sensor, actuator, MEMS and CMOS device reliability, as well as the metrology of semiconductor device reliability. We welcome original research, reviews (including mini reviews) and perspective articles on reliability metrology, testing and failure analysis of semiconductor devices. Topics of interest include, but are not limited to, the following research areas:
- Reliability metrology, testing and failure analysis of sensors;
- Reliability metrology, testing and failure analysis of actuators;
- Reliability metrology, testing and failure analysis of MEMS devices;
- Reliability metrology, testing and failure analysis of CMOS devices.
Dr. Liangxing Hu
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- reliability metrology
- test
- failure analysis
- semiconductor devices
- sensors
- actuators
- MEMS
- CMOS devices
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