The Fabrication of Microstructures from Powders and Their Applications in Microsystems
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".
Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 22546
Special Issue Editor
Special Issue Information
Dear Colleagues,
The application potential of microsystem technology is continuously increasing as new fabrication processes overcome substantial constraints. Among them is the realization of three-dimensional (3D) microstructures with sizes between tens and hundreds of microns from a broad variety of materials. Common MEMS and IC processes do not meet these requirements adequately. A promising alternative is the utilization of micron-sized powder to create 3D microstructures. Although numerous approaches have been presented already, the application of powder-based techniques for MEMS is still in its initial stages. To enable cost-effective production, it should be possible to integrate powder-based 3D microstructures into proven fabrication processes on large-scale silicon, glass, ceramic or plastic substrates, panels or boards.
Accordingly, this Special Issue seeks to showcase research papers and review articles that focus on: (1) powder-based techniques for 3D microstructure fabrication compatible to silicon, glass, ceramic or plastic substrates, panels or boards; (2) simulation and characterization of powder-based 3D microstructures fabricated from various materials; (3) fabrication, simulation and characterization of MEMS devices utilizing powder-based 3D microstructures; (4) novel functionalities and applications for MEMS due to powder-based 3D microstructures; (5) durability, reliability and long-term stability of powder-based 3D microstructures.
Dr. Thomas Lisec
Guest Editor
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Keywords
- powder-based techniques
- 3D microstructures
- MEMS
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