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Journal: Coatings, 2019
Volume: 9
Number: 128

Article: A Deep Insight into the Electronic Properties of CIGS Modules with Monolithic Interconnects Based on 2D Simulations with TCAD
Authors: by Ricardo Vidal Lorbada, Thomas Walter, David Fuertes Marrón, Tetiana Lavrenko and Dennis Muecke
Link: https://www.mdpi.com/2079-6412/9/2/128

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