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14 pages, 6787 KiB

Open AccessArticle

Hierarchical Micro/Nanostructures with Anti-Reflection and Superhydrophobicity on the Silicon Surface Fabricated by Femtosecond Laser

by Junyu Duan, Gui Long, Xu Xu, Weiming Liu, Chuankun Li, Liang Chen, Jianguo Zhang and Junfeng Xiao

Micromachines 2024, 15(11), 1304; https://doi.org/10.3390/mi15111304 - 27 Oct 2024

Viewed by 457

Abstract

In this paper, hierarchical micro/nano structures composed of periodic microstructures, laser-induced periodic surface structures (LIPSS), and nanoparticles were fabricated by femtosecond laser processing (LP). A layer of hydrophobic species was formed on the micro/nano structures through perfluorosilane modification (PM). The reflectivity and hydrophobicity’s [...] Read more.

In this paper, hierarchical micro/nano structures composed of periodic microstructures, laser-induced periodic surface structures (LIPSS), and nanoparticles were fabricated by femtosecond laser processing (LP). A layer of hydrophobic species was formed on the micro/nano structures through perfluorosilane modification (PM). The reflectivity and hydrophobicity’s influence mechanisms of structural height, duty cycle, and size are experimentally elucidated. The average reflectivity of the silicon surface in the visible light band is reduced to 3.0% under the optimal parameters, and the surface exhibits a large contact angle of 172.3 ± 0.8° and a low sliding angle of 4.2 ± 1.4°. Finally, the durability of the anti-reflection and superhydrophobicity is also confirmed. This study deepens our understanding of the principles of anti-reflection and superhydrophobicity and expands the design and preparation methods for self-cleaning and anti-reflective surfaces. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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14 pages, 3669 KiB

Open AccessArticle

A Normal Displacement Model and Compensation Method of Polishing Tool for Precision CNC Polishing of Aspheric Surface

by Yongjie Shi, Min Su, Qianqian Cao and Di Zheng

Micromachines 2024, 15(11), 1300; https://doi.org/10.3390/mi15111300 - 25 Oct 2024

Viewed by 345

Abstract

The position accuracy of the polishing tool affects the surface quality of the polished aspheric surface. The contact deformation among the polishing tool, abrasives, and aspheric part can cause a displacement, which, in turn, will cause a position error of the polishing tool, [...] Read more.

The position accuracy of the polishing tool affects the surface quality of the polished aspheric surface. The contact deformation among the polishing tool, abrasives, and aspheric part can cause a displacement, which, in turn, will cause a position error of the polishing tool, which will lead to a significant change in the polishing force. In order to resolve this error, this paper proposed a method of normal displacement compensation for a computer numerical controlled (CNC) polishing system by controlling the polishing force. Firstly, the coupling principle between the polishing force and the position of the polishing tool is expounded, and the relationship between normal displacement and deformation is analyzed. Based on Hertz’s theory, a model of normal displacement is established. Then, on the basis of the decoupled polishing system developed, a normal displacement compensation method was proposed. Finally, a group of comparative experiments was carried out to verify the effectiveness of the proposed method. Compared with no displacement compensation, when the part was polished with the normal displacement compensation method, the value of roughness decreased from 0.4 µm to 0.21 µm, and the unevenness coefficient of surface roughness decreased from 112.5% to 19%. The experimental results show that the polishing quality is improved greatly, and the aspheric surfaces can be polished more uniformly with the method proposed in this paper. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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17 pages, 5166 KiB

Open AccessArticle

Integration of Metrology in Grinding and Polishing Processes for Rotationally Symmetrical Aspherical Surfaces with Optimized Material Removal Functions

by Ravi Pratap Singh and Yaolong Chen

Micromachines 2024, 15(10), 1276; https://doi.org/10.3390/mi15101276 - 21 Oct 2024

Viewed by 457

Abstract

Aspherical surfaces, with their varying curvature, minimize aberrations and enhance clarity, making them essential in optics, aerospace, medical devices, and telecommunications. However, manufacturing these surfaces is challenging because of systematic errors in CNC equipment, tool wear, measurement inaccuracies, and environmental disturbances. These issues [...] Read more.

Aspherical surfaces, with their varying curvature, minimize aberrations and enhance clarity, making them essential in optics, aerospace, medical devices, and telecommunications. However, manufacturing these surfaces is challenging because of systematic errors in CNC equipment, tool wear, measurement inaccuracies, and environmental disturbances. These issues necessitate precise error compensation to achieve the desired surface shape. Traditional methods for spherical optics are inadequate for aspherical components, making accurate surface shape error detection and compensation crucial. This study integrates advanced metrology with optimized material removal functions in the grinding and polishing processes. By combining numerical control technology, computer technology, and data analysis, we developed CAM software (version 1) tailored for aspherical surfaces. This software uses a compensation correction algorithm to process error data and generate NC programs for machining. Our approach automates and digitizes the grinding and polishing process, improving efficiency and surface accuracy. This advancement enables high-precision mass production of rotationally symmetrical aspherical optical components, addressing existing manufacturing challenges and enhancing optical system performance. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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15 pages, 7954 KiB

Open AccessArticle

Investigation on the Machinability of Polycrystalline ZnS by Micro-Laser-Assisted Diamond Cutting

by Haoqi Luo, Xue Wang, Lin Qin, Hongxin Zhao, Deqing Zhu, Shanyi Ma, Jianguo Zhang and Junfeng Xiao

Micromachines 2024, 15(10), 1275; https://doi.org/10.3390/mi15101275 - 21 Oct 2024

Viewed by 531

Abstract

Polycrystalline ZnS is a typical infrared optical material. It is widely used in advanced optical systems due to its excellent optical properties. The machining accuracy of polycrystalline ZnS optical elements must satisfy the requirements of high-performance system development. However, the soft and brittle [...] Read more.

Polycrystalline ZnS is a typical infrared optical material. It is widely used in advanced optical systems due to its excellent optical properties. The machining accuracy of polycrystalline ZnS optical elements must satisfy the requirements of high-performance system development. However, the soft and brittle nature of the material poses a challenge for high-quality and efficient machining. In recent years, in situ laser-assisted diamond cutting has been proven to be an effective method for ultra-precision cutting of brittle materials. In this study, the mechanism of in situ laser-assisted cutting on ultra-precision cutting machinability enhancement of ZnS was investigated. Firstly, the physical properties of ZnS were characterized by high-temperature nanoindentation experiments. The result revealed an increase in ductile machinability of ZnS due to plastic deformation and a decrease in microhardness and Young’s modulus at high temperatures. It provided a fundamental theory for the ductile–brittle transition of ZnS. Subsequently, a series of diamond-cutting experiments were carried out to study the removal mechanism of ZnS during in situ laser-assisted cutting. It was found that the mass damage initiation depth groove generated by in situ laser-assisted cutting increased by 57.99% compared to the groove generated by ordinary cutting. It was found that micron-sized pits were suppressed under in situ laser-assisted cutting. The main damage form of HIP-ZnS was changed from flake spalling and pits to radial cleavage cracks. Additionally, the laser can suppress the removal mode difference of different grain crystallographic and ensure the ductile region processing. Finally, planning cutting experiments were carried out to verify that a smooth and uniform surface with Sa of 3.607 nm was achieved at a laser power of 20 W, which was 73.58% better than normal cutting. The main components of roughness were grain boundary steps and submicron pit. This study provides a promising method for ultra-precision cutting of ZnS. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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16 pages, 10385 KiB

Open AccessArticle

Laser Direct Writing of Setaria Virids-Inspired Hierarchical Surface with TiO₂ Coating for Anti-Sticking of Soft Tissue

by Qingxu Zhang, Yanyan Yang, Shijie Huo, Shucheng Duan, Tianao Han, Guang Liu, Kaiteng Zhang, Dengke Chen, Guang Yang and Huawei Chen

Micromachines 2024, 15(9), 1155; https://doi.org/10.3390/mi15091155 - 15 Sep 2024

Viewed by 852

Abstract

In minimally invasive surgery, the tendency for human tissue to adhere to the electrosurgical scalpel can complicate procedures and elevate the risk of medical accidents. Consequently, the development of an electrosurgical scalpel with an anti-sticking coating is critically important. Drawing inspiration from nature, [...] Read more.

In minimally invasive surgery, the tendency for human tissue to adhere to the electrosurgical scalpel can complicate procedures and elevate the risk of medical accidents. Consequently, the development of an electrosurgical scalpel with an anti-sticking coating is critically important. Drawing inspiration from nature, we identified that the leaves of Setaria Virids exhibit exceptional non-stick properties. Utilizing this natural surface texture as a model, we designed and fabricated a specialized anti-sticking surface for electrosurgical scalpels. Employing nanosecond laser direct writing ablation technology, we created a micro-nano textured surface on the high-frequency electrosurgical scalpel that mimics the structure found on Setaria Virids leaves. Subsequently, a TiO₂ coating was deposited onto the ablated scalpel surface via magnetron sputtering, followed by plasma-induced hydrophobic modification and treatment with octadecyltrichlorosilane (OTS) to enhance the surface’s affinity for silicone oil, thereby constructing a self-lubricating and anti-sticking surface. The spreading behavior of deionized water, absolute ethanol, and dimethyl silicone oil on this textured surface is investigated to confirm the effectiveness of the self-lubrication mechanism. Furthermore, the sticking force and quality are compared between the anti-sticking electrosurgical scalpel and a standard high-frequency electrosurgical scalpel to demonstrate the efficacy of the nanosecond laser-ablated micro-nano texture in preventing sticking. The findings indicate that the self-lubricating anti-sticking surface fabricated using this texture exhibits superior anti-sticking properties. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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15 pages, 7305 KiB

Open AccessFeature PaperEditor’s ChoiceArticle

Contact Hole Shrinkage: Simulation Study of Resist Flow Process and Its Application to Block Copolymers

by Sang-Kon Kim

Micromachines 2024, 15(9), 1151; https://doi.org/10.3390/mi15091151 - 13 Sep 2024

Viewed by 971

Abstract

For vertical interconnect access (VIA) in three-dimensional (3D) structure chips, including those with high bandwidth memory (HBM), shrinking contact holes (C/Hs) using the resist flow process (RFP) represents the most promising technology for low- [...] Read more.

For vertical interconnect access (VIA) in three-dimensional (3D) structure chips, including those with high bandwidth memory (HBM), shrinking contact holes (C/Hs) using the resist flow process (RFP) represents the most promising technology for low-

k_{1} (w h e r e C D = k_{1} λ / N A,

C D

is the critical dimension,

λ

is wavelength, and

N A

is the numerical aperture). This method offers a way to reduce dimensions without additional complex process steps and is independent of optical technologies. However, most empirical models are heuristic methods and use linear regression to predict the critical dimension of the reflowed structure but do not account for intermediate shapes. In this research, the resist flow process (RFP) was modeled using the evolution method, the finite-element method, machine learning, and deep learning under various reflow conditions to imitate experimental results. Deep learning and machine learning have proven to be useful for physical optimization problems without analytical solutions, particularly for regression and classification tasks. In this application, the self-assembly of cylinder-forming block copolymers (BCPs), confined in prepatterns of the resist reflow process (RFP) to produce small contact hole (C/H) dimensions, was described using the self-consistent field theory (SCFT). This research paves the way for the shrink modeling of the enhanced resist reflow process (RFP) for random contact holes (C/Hs) and the production of smaller contact holes. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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9 pages, 3136 KiB

Open AccessCommunication

Off-Stoichiometry Thiol-Ene (OSTE) Micro Mushroom Forest: A Superhydrophobic Substrate

by Haonan Li, Muyang Zhang, Yeqian Liu, Shangneng Yu, Xionghui Li, Zejingqiu Chen, Zitao Feng, Jie Zhou, Qinghao He, Xinyi Chen, Huiru Zhang, Jiaen Zhang, Xingwei Zhang and Weijin Guo

Micromachines 2024, 15(9), 1088; https://doi.org/10.3390/mi15091088 - 28 Aug 2024

Viewed by 600

Abstract

Superhydrophobic surfaces have been used in various fields of engineering due to their resistance to corrosion and fouling and their ability to control fluid movement. Traditionally, superhydrophobic surfaces are fabricated via chemical methods of changing the surface energy or mechanical methods of controlling [...] Read more.

Superhydrophobic surfaces have been used in various fields of engineering due to their resistance to corrosion and fouling and their ability to control fluid movement. Traditionally, superhydrophobic surfaces are fabricated via chemical methods of changing the surface energy or mechanical methods of controlling the surface topology. Many of the conventional mechanical methods use a top-to-bottom scheme to control the surface topolopy. Here, we develop a novel fabrication method of superhydrophobic substrates using a bottom-to-top scheme via polymer OSTE, which is a prototyping polymer material developed for the fabrication of microchips due to its superior photocuring ability, mechanical properties, and surface modification ability. We fabricate a superhydrophobic substrate by OSTE–OSTE micro mushroom forest via a two-step lithography process. At first, we fabricate an OSTE pillar forest as the mushroom stems; then, we fabricate the mushroom heads via backside lithography with diffused UV light. Such topology and surface properties of OSTE render these structures superhydrophobic, with water droplets reaching a contact angle of 152.9 ± 0.2°, a sliding angle of 4.1°, and a contact angle hysteresis of less than 0.5°. These characteristics indicate the promising potential of this substrate for superhydrophobic applications. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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13 pages, 9241 KiB

Open AccessArticle

The Synthesis and Assembly Mechanism of Micro/Nano-Sized Polystyrene Spheres and Their Application in Subwavelength Structures

by Yeeu-Chang Lee, Hsu-Kang Wu, Yu-Zhong Peng and Wei-Chun Chen

Micromachines 2024, 15(7), 841; https://doi.org/10.3390/mi15070841 - 28 Jun 2024

Cited by 1 | Viewed by 742

Abstract

The following study involved the utilization of dispersion polymerization to synthesize micron/nano-sized polystyrene (PS) spheres, which were then deposited onto a silicon substrate using the floating assembly method to form a long-range monolayer. Subsequently, dry etching techniques were utilized to create subwavelength structures. [...] Read more.

The following study involved the utilization of dispersion polymerization to synthesize micron/nano-sized polystyrene (PS) spheres, which were then deposited onto a silicon substrate using the floating assembly method to form a long-range monolayer. Subsequently, dry etching techniques were utilized to create subwavelength structures. The adjustment of the stabilizer polyvinylpyrrolidone (PVP), together with changes in the monomer concentration, yielded PS spheres ranging from 500 nm to 5.6 μm in diameter. These PS spheres were suspended in a mixture of alcohol and deionized water before being arranged using the floating assembly method. The resulting tightly packed particle arrangement is attributed to van der Waals forces, Coulomb electrostatic forces between the PS spheres, and surface tension effects. The interplay of these forces was analyzed to comprehend the resulting structure. Dry etching, utilizing the PS spheres as masks, enabled the exploration of the effects of etching parameters on the resultant structures. Unlike traditional dry etching methods controlling RF power and etching gases, in the present study, we focused on adjusting the oxygen flow rate to achieve cylindrical, conical, and parabolic etched structures. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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17 pages, 6669 KiB

Open AccessArticle

Understanding the Effect of Dispersant Rheology and Binder Decomposition on 3D Printing of a Solid Oxide Fuel Cell

by Man Yang, Santosh Kumar Parupelli, Zhigang Xu and Salil Desai

Micromachines 2024, 15(5), 636; https://doi.org/10.3390/mi15050636 - 9 May 2024

Cited by 2 | Viewed by 1226

Abstract

Solid oxide fuel cells (SOFCs) are a green energy technology that offers a cleaner and more efficient alternative to fossil fuels. The efficiency and utility of SOFCs can be enhanced by fabricating miniaturized component structures within the fuel cell footprint. In this research [...] Read more.

Solid oxide fuel cells (SOFCs) are a green energy technology that offers a cleaner and more efficient alternative to fossil fuels. The efficiency and utility of SOFCs can be enhanced by fabricating miniaturized component structures within the fuel cell footprint. In this research work, the parallel-connected inter-digitized design of micro-single-chamber SOFCs (µ-SC-SOFCs) was fabricated by a direct-write microfabrication technique. To understand and optimize the direct-write process, the cathode electrode slurry was investigated. Initially, the effects of dispersant Triton X-100 on LSCF (La0.6Sr0.2Fe0.8Co0.2O3-δ) slurry rheology was investigated. The effect of binder decomposition on the cathode electrode lines was evaluated, and further, the optimum sintering profile was determined. Results illustrate that the optimum concentration of Triton X-100 for different slurries was around 0.2–0.4% of the LSCF solid loading. A total of 60% of solid loading slurries had high viscosities and attained stability after 300 s. In addition, 40–50% solid loading slurries had relatively lower viscosity and attainted stability after 200 s. Solid loading and binder affected not only the slurry’s viscosity but also its rheology behavior. Based on the findings of this research, a slurry with 50% solid loading, 12% binder, and 0.2% dispersant was determined to be the optimal value for the fabricating of SOFCs using the direct-write method. This research work establishes guidelines for fabricating the micro-single-chamber solid oxide fuel cells by optimizing the direct-write slurry deposition process with high accuracy. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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13 pages, 3470 KiB

Open AccessArticle

Micromirror Array with Adjustable Reflection Characteristics Based on Different Microstructures and Its Application

by Hao Cao, Zhishuang Xue, Hongfeng Deng, Shuo Chen, Deming Wang and Chengqun Gui

Micromachines 2024, 15(4), 506; https://doi.org/10.3390/mi15040506 - 8 Apr 2024

Cited by 1 | Viewed by 1267

Abstract

The conventional reflective optical surface with adjustable reflection characteristics requires a complex external power source. The complicated structure and preparation process of the power system leads to the limited modulation of the reflective properties and difficulty of use in large-scale applications. Inspired by [...] Read more.

The conventional reflective optical surface with adjustable reflection characteristics requires a complex external power source. The complicated structure and preparation process of the power system leads to the limited modulation of the reflective properties and difficulty of use in large-scale applications. Inspired by the biological compound eye, different microstructures are utilized to modulate the optical performance. Convex aspheric micromirror arrays (MMAs) can increase the luminance gain while expanding the field of view, with a luminance gain wide angle > 90° and a field-of-view wide angle close to 180°, which has the reflective characteristics of a large gain wide angle and a large field-of-view wide angle. Concave aspheric micromirror arrays can increase the luminance gain by a relatively large amount of up to 2.66, which has the reflective characteristics of high gain. Industrial-level production and practical applications in the projection display segment were carried out. The results confirmed that convex MMAs are able to realize luminance gain over a wide spectrum and a wide range of angles, and concave MMAs are able to substantially enhance luminance gain, which may provide new opportunities in developing advanced reflective optical surfaces. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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10 pages, 2264 KiB

Open AccessArticle

The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching

by Jonghyeok Kim, Byungjoo Kim, Jiyeon Choi and Sanghoon Ahn

Micromachines 2024, 15(3), 320; https://doi.org/10.3390/mi15030320 - 25 Feb 2024

Cited by 1 | Viewed by 1857

Abstract

This research focuses on the manufacturing of a glass interposer that has gone through glass via (TGV) connection holes. Glass has unique properties that make it suitable for 3D integrated circuit (IC) interposers, which include low permittivity, high transparency, and adjustable thermal expansion [...] Read more.

This research focuses on the manufacturing of a glass interposer that has gone through glass via (TGV) connection holes. Glass has unique properties that make it suitable for 3D integrated circuit (IC) interposers, which include low permittivity, high transparency, and adjustable thermal expansion coefficient. To date, various studies have suggested numerous techniques to generate holes in glass. In this study, we adopt the selective laser etching (SLE) technique. SLE consists of two processes: local modification via an ultrashort pulsed laser and chemical etching. In our previous study, we found that the process speed can be enhanced by changing the local modification method. For further enhancement in the process speed, in this study, we focus on the chemical etching process. In particular, we try to find a proper etchant for TGV formation. Here, four different etchants (HF, KOH, NaOH, and NH₄F) are compared in order to improve the etching speed. For a quantitative comparison, we adopt the concept of selectivity. The results show that NH₄F has the highest selectivity; therefore, we can tentatively claim that it is a promising candidate etchant for generating TGV. In addition, we also observe a taper angle variation according to the etchant used. The results show that the taper angle of the hole is dependent on the concentration of the etchant as well as the etchant itself. These results may be applicable to various industrial fields that aim to adjust the taper angle of holes. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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16 pages, 5453 KiB

Open AccessArticle

An Improved 3D OPC Method for the Fabrication of High-Fidelity Micro Fresnel Lenses

by Fei Peng, Chao Sun, Hui Wan and Chengqun Gui

Micromachines 2023, 14(12), 2220; https://doi.org/10.3390/mi14122220 - 9 Dec 2023

Viewed by 1496

Abstract

Based on three-dimensional optical proximity correction (3D OPC), recent advancements in 3D lithography have enabled the high-fidelity customization of 3D micro-optical elements. However, the micron-to-millimeter-scale structures represented by the Fresnel lens design bring more stringent requirements for 3D OPC, which poses significant challenges [...] Read more.

Based on three-dimensional optical proximity correction (3D OPC), recent advancements in 3D lithography have enabled the high-fidelity customization of 3D micro-optical elements. However, the micron-to-millimeter-scale structures represented by the Fresnel lens design bring more stringent requirements for 3D OPC, which poses significant challenges to the accuracy of models and the efficiency of algorithms. Thus, a lithographic model based on optical imaging and photochemical reaction curves is developed in this paper, and a subdomain division method with a statistics principle is proposed to improve the efficiency and accuracy of 3D OPC. Both the simulation and the experimental results show the superiority of the proposed 3D OPC method in the fabrication of Fresnel lenses. The computation memory requirements of the 3D OPC are reduced to below 1%, and the profile error of the fabricated Fresnel lens is reduced 79.98%. Applying the Fresnel lenses to an imaging system, the average peak signal to noise ratio (PSNR) of the image is increased by 18.92%, and the average contrast of the image is enhanced by 36%. We believe that the proposed 3D OPC method can be extended to the fabrication of vision-correcting ophthalmological lenses. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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Review

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26 pages, 24565 KiB

Open AccessReview

A Review of Femtosecond Laser Processing of Silicon Carbide

by Quanjing Wang, Ru Zhang, Qingkui Chen and Ran Duan

Micromachines 2024, 15(5), 639; https://doi.org/10.3390/mi15050639 - 10 May 2024

Cited by 1 | Viewed by 5111

Abstract

Silicon carbide (SiC) is a promising semiconductor material as well as a challenging material to machine, owing to its unique characteristics including high hardness, superior thermal conductivity, and chemical inertness. The ultrafast nature of femtosecond lasers enables precise and controlled material removal and [...] Read more.

Silicon carbide (SiC) is a promising semiconductor material as well as a challenging material to machine, owing to its unique characteristics including high hardness, superior thermal conductivity, and chemical inertness. The ultrafast nature of femtosecond lasers enables precise and controlled material removal and modification, making them ideal for SiC processing. In this review, we aim to provide an overview of the process properties, progress, and applications by discussing the various methodologies involved in femtosecond laser processing of SiC. These methodologies encompass direct processing, composite processing, modification of the processing environment, beam shaping, etc. In addition, we have explored the myriad applications that arise from applying femtosecond laser processing to SiC. Furthermore, we highlight recent advancements, challenges, and future prospects in the field. This review provides as an important direction for exploring the progress of femtosecond laser micro/nano processing, in order to discuss the diversity of processes used for manufacturing SiC devices. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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30 pages, 17885 KiB

Open AccessFeature PaperEditor’s ChoiceReview

Review on Abrasive Machining Technology of SiC Ceramic Composites

by Huiyun Zhang, Zhigang Zhao, Jiaojiao Li, Linzheng Ye and Yao Liu

Micromachines 2024, 15(1), 106; https://doi.org/10.3390/mi15010106 - 7 Jan 2024

Cited by 3 | Viewed by 2837

Abstract

Ceramic matrix composites have the advantages of low density, high specific strength, high specific die, high-temperature resistance, wear resistance, chemical corrosion resistance, etc., which are widely used in aerospace, energy, transportation, and other fields. CMCs have become an important choice for engine components [...] Read more.

Ceramic matrix composites have the advantages of low density, high specific strength, high specific die, high-temperature resistance, wear resistance, chemical corrosion resistance, etc., which are widely used in aerospace, energy, transportation, and other fields. CMCs have become an important choice for engine components and other high-temperature component manufacturing. However, ceramic matrix composite is a kind of multi-phase structure, anisotropy, high hardness material, due to the brittleness of the ceramic matrix, the weak bonding force between fiber and matrix, and the anisotropy of composite material. Burr, delamination, tearing, chips, and other surface damage tend to generate in the machining, resulting in surface quality and strength decline. This paper reviewed the latest abrasive machining technology for SiC ceramic composites. The characteristics and research directions of the main abrasive machining technology, including grinding, laser-assisted grinding, ultrasonic-assisted grinding, and abrasive waterjet machining, are introduced first. Then, the commonly used numerical simulation research for modeling and simulating the machining of ceramic matrix composites is briefly summarized. Finally, the processing difficulties and research hotspots of ceramic matrix composites are summarized. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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24 pages, 6607 KiB

Open AccessReview

Scanning Strategies in Laser Surface Texturing: A Review

by Denys Moskal, Jiří Martan and Milan Honner

Micromachines 2023, 14(6), 1241; https://doi.org/10.3390/mi14061241 - 12 Jun 2023

Cited by 12 | Viewed by 3306

Abstract

Laser surface texturing (LST) is one of the most promising technologies for controllable surface structuring and the acquisition of specific physical surface properties needed in functional surfaces. The quality and processing rate of the laser surface texturing strongly depend on the correct choice [...] Read more.

Laser surface texturing (LST) is one of the most promising technologies for controllable surface structuring and the acquisition of specific physical surface properties needed in functional surfaces. The quality and processing rate of the laser surface texturing strongly depend on the correct choice of a scanning strategy. In this paper, a comparative review of the classical and recently developed scanning strategies of laser surface texturing is presented. The main attention is paid to maximal processing rate, precision and existing physical limitations. Possible ways of further development of the laser scanning strategies are proposed. Full article

(This article belongs to the Special Issue Recent Advances in Micro/Nano-Fabrication)

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