Advanced Flexible/Soft Electronics and Displays

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E:Engineering and Technology".

Deadline for manuscript submissions: 25 July 2024 | Viewed by 1030

Special Issue Editor


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Guest Editor
School of Chemical, Biological, and Battery Engineering, Gachon University, Seongnam-si 13120, Republic of Korea
Interests: soft electronics; stretchable electronics; polymer materials; stretchable nanocomposite; quantum dot LEDs
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Flexible/soft electronics and displays can withstand mechanical deformations during device operation, making it possible to seamlessly conform to various curved objects, including the human body. These unique characteristics have enabled a wide range of human-friendly bio-electronic applications, such as personalized healthcare systems, wearable smart displays, and implantable prosthetic devices. One of the key factors contributing to the success of soft electronics is their ability to provide mechanical flexibility while ensuring a high level of device performance and stability. To address these challenges, there has an been extensive research effort focused on advancing soft electronics and displays, ranging from the exploration of mechanically soft electronic/optoelectronic materials to geometrically designed device structures for efficient strain management. Accordingly, this Special Issue encourages the submission of research papers, communications, and review papers that offer significant scientific contributions and/or perspectives related to various key topics, such as the following:

  • Soft, flexible, stretchable electronics and optoelectronic devices;
  • Properties, fabrication, and applications of soft materials, structures, electronics, and systems;
  • Specially designed device structures to accommodate mechanical deformation;
  • Scalable assembly and patterning process of soft electronic/optoelectronic materials;
  • Intrinsically soft electronic/optoelectronic materials, devices, and their applications.

Dr. Dong Chan Kim
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • soft, flexible, stretchable electronics
  • flexible, foldable and stretchable displays
  • OLED/QD-LED/Pe-LED
  • wearable sensors and actuators
  • soft electronic/optoelectronic materials

Published Papers (1 paper)

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Research

9 pages, 2191 KiB  
Article
Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density
by Myeongho Park, Bin Yoo, Myeonghwan Hong, Daeun Cho, Yunjin Jeong, Cheolheon Park, Jaemin Kim, Tae-Min Ha, Garam Kim, Sang Jeen Hong and Daewon Lee
Micromachines 2024, 15(3), 300; https://doi.org/10.3390/mi15030300 - 22 Feb 2024
Viewed by 716
Abstract
This manuscript presents a comprehensive study on the assembly of microchips using fluidic self-assembly (FSA) technology, with a focus on optimizing the spacing between binding sites to improve yield and assembly. Through a series of experiments, we explored the assembly of microchips on [...] Read more.
This manuscript presents a comprehensive study on the assembly of microchips using fluidic self-assembly (FSA) technology, with a focus on optimizing the spacing between binding sites to improve yield and assembly. Through a series of experiments, we explored the assembly of microchips on substrates with varying binding site spacings, revealing the impact of spacing on the rate of undesired chip assembly across multiple sites. Our findings indicate a significant reduction in incorrect assembly rates as the spacing increases beyond a critical threshold of 140 μm. This study delves into the mechanics of chip alignment within the fluid medium, hypothesizing that the extent of the alloy’s grip on the chips at different spacings influences assembly outcomes. By analyzing cases of undesired assembly, we identified the relationship between binding site spacing and the area of chip contact, demonstrating a decrease in the combined left and right areas of chips as the spacing increases. The results highlight a critical spacing threshold, which, when optimized, could significantly enhance the efficiency and precision of microchip assembly processes using FSA technology. This research contributes to the field of microcomponent assembly, offering insights into achieving higher integration densities and precision in applications, such as microLED displays and augmented reality (AR) devices. Full article
(This article belongs to the Special Issue Advanced Flexible/Soft Electronics and Displays)
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