Dear Colleagues,

Being a high-fluidity, highly conductive material at room temperature, liquid alloys demonstrate numerous attractive advantages in many aspects, particularly for the deformable smart system in dynamic situations. Potentially, they will be an essential part of future soft intelligence and ultimately serve as an intimate partner of our daily life.

We invite original research papers, technical notes and shorter communications that focus on all areas on liquid alloy development at the micro/nanoscale, from fundamental research, including materials, interface, processing and devices, to application exploration, including biology, environment, electromagnetics, agriculture and robots, to contribute to this Special Issue. We are also looking for high-quality comprehensive reviews and perspectives that reference prior interest expressed to the Editorial Office and have received formal approval. Topics of particular interest include but are not limited to the following:

Materials discovery and processing:

• Physical and chemical properties;
• Bulky, droplet, marble, and composites;
• Interface characteristics regulation;
• Manufacturing process technologies.

Structures and devices:

• Advanced micro/nanostructures or simulations;
• Ultra-high-sensitivity flexible sensors;
• Multi-modal sensors;
• Environment or health monitoring sensors;
• Microfluidic chips or devices;
• Flexible or deformable actuators.

Systems and applications:

• Diagnostics or therapy;
• Biotechnology;
• Soft machines;
• Wearable devices;
• Reconfigurable antenna or radio frequency (RF) devices;
• Thermal cooling system design and devices;
• Precision agriculture and plants protection;
• Ocean or space exploration;
• Sensing and manipulation of intelligent soft robotics.

Prof. Dr. Zhigang Wu
Prof. Dr. Wei Rao
Guest Editors

Manuscript Submission Information

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