Novel Integrated Photonic Devices Incorporating 2D Materials

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: closed (31 December 2023) | Viewed by 987

Special Issue Editors


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Guest Editor
School of Physics, Peking University, Beijing 100871, China
Interests: integrated photonics; nonlinear optics; 2D materials
Special Issues, Collections and Topics in MDPI journals
Optical Sciences Centre, Swinburne University of Technology, Hawthorn, VIC 3122, Australia
Interests: integrated photonics; nonlinear optics; 2D materials; optical communications
Special Issues, Collections and Topics in MDPI journals
Optical Sciences Centre, Swinburne University of Technology, Hawthorn, VIC 3122, Australia
Interests: 2D materials; nonlinear optics; optoelectronic devices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

With their compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated photonic devices have found wide applications in many key technologies of the current information age. Recent advances in 2D layered materials with their unique structures and distinctive properties have motivated their on-chip integration to overcome the limitations of conventional integrated photonic platforms. The incorporation of 2D materials into integrated photonic devices combines the best of both worlds, and this has yielded a variety of functional photonic devices with superior performance and new features for diverse applications.

This Special Issue seeks to showcase research papers and review articles that focus on the investigation of novel integrated photonic devices incorporating different kinds of 2D materials for a wide scope of applications including solar energy harvesting, energy storage, medical diagnosis, image display, and optical communications. Either theoretical analysis or experimental work are acceptable.

Dr. Yuning Zhang
Dr. Jiayang Wu
Dr. Linnan Jia
Guest Editors

Manuscript Submission Information

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Keywords

  • integrated photonics
  • 2D materials

Published Papers (1 paper)

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Research

10 pages, 16764 KiB  
Article
Comparison of Microcomb-Based Radio-Frequency Photonic Transversal Signal Processors Implemented with Discrete Components Versus Integrated Chips
by Yang Sun, Jiayang Wu, Yang Li and David J. Moss
Micromachines 2023, 14(9), 1794; https://doi.org/10.3390/mi14091794 - 20 Sep 2023
Viewed by 727
Abstract
RF photonic transversal signal processors, which combine reconfigurable electrical digital signal processing and high-bandwidth photonic processing, provide a powerful solution for achieving adaptive high-speed information processing. Recent progress in optical microcomb technology provides compelling multi-wavelength sources with a compact footprint, yielding a variety [...] Read more.
RF photonic transversal signal processors, which combine reconfigurable electrical digital signal processing and high-bandwidth photonic processing, provide a powerful solution for achieving adaptive high-speed information processing. Recent progress in optical microcomb technology provides compelling multi-wavelength sources with a compact footprint, yielding a variety of microcomb-based RF photonic transversal signal processors with either discrete or integrated components. Although they operate based on the same principle, the processors in these two forms exhibit distinct performances. This paper presents a comparative investigation of their performances. First, we compare the performances of state-of-the-art processors, focusing on the processing accuracy. Next, we analyze various factors that contribute to the performance differences, including the tap number and imperfect response of experimental components. Finally, we discuss the potential for future improvement. These results provide a comprehensive comparison of microcomb-based RF photonic transversal signal processors implemented using discrete and integrated components and provide insights for their future development. Full article
(This article belongs to the Special Issue Novel Integrated Photonic Devices Incorporating 2D Materials)
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