Micro/Nano Devices and Its Tribology
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: closed (31 January 2021) | Viewed by 4398
Special Issue Editor
Special Issue Information
Dear Colleagues,
The interest and demand for micro-/nanoscale devices have been steadily growing in line with rapid advancements in the fabrication and manufacturing processes over the past decades. With the development of more sophisticated manufacturing process (e.g., EUV, extreme ultraviolet), the minimum dimensions of electronic device components have reached down to several nm in order to maximize the level of integration and enhance the performance within a limited volume. Nevertheless, reducing the dimensions has resulted in changes in the mechanical, physical, and chemical properties, which have accelerated the tribological failure of components at the micro-/nanoscale. In this regard, not only is a fundamental understanding of the failure mechanisms required but profound solutions are also essential for overcoming such failure issues. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on the tribology of microelectronic devices, soft electronics, MEMS, and other microelectronic devices for tribological applications. Of interest are also papers that examine the tribological properties (i.e., friction, wear, surface engineering, and durability, to name a few) of novel materials for microelectronic devices.
We look forward to receiving your submissions!
Dr. Hae-Jin Kim
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Keywords
- tribology of microelectronic devices
- tribology of soft electronics
- tribology of MEMS
- microelectronic devices for tribological applications
- tribological properties of the materials for microelectronic devices
Related Special Issue
- Microtribology, Adhesion and Surface Engineering in Micromachines (8 articles)
