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Micromachines
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Piezoelectric MEMS
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Piezoelectric MEMS

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (30 September 2015) | Viewed by 34469

Special Issue Editors

Prof. Dr. Meiling Zhu

E-Mail Website
Guest Editor
College of Engineering, Mathematics and Physical Sciences, Exeter University, Devon EX4 4SB, UK
Interests: piezoMEMS; energy harvesting and systems; micro-sensors; micro-actuators; wireless sensoring
Dr. Nathan Jackson

E-Mail Website
Guest Editor
Tyndall National Institute, University College Cork, Cork, Ireland
Interests: piezoMEMS; energy harvesting; resonators; biosensors; bioMEMS; flexible circuits; MEMS packaging

Special Issue Information

Dear Colleagues,

This Special Issue on “Piezoelectric MEMS,” for the journal Micromachines, will publish original work focusing on the use of piezoelectric materials in MEMS. Papers can include areas focusing on fabrication techniques, material development, devices/systems, integration, and packaging. Possible applications include, but are not limited to, energy harvesting, biomedicine, resonators, sensors, and transducers.

Piezoelectric materials are widely used in everyday applications. However, there is still a high demand for developing novel piezoelectric materials, optimizing the deposition of piezoelectrics, and integrating material into MEMS devices. Piezoelectric materials continue to show significant advances in the areas of energy harvesting, biomedicine, ultrasound, telecommunications, and in applications concerning the “internet of things”. This Special Issue seeks out original manuscripts or review papers, short communications, and full length papers that involve Piezoelectric MEMS devices or material development.

Prof. Dr. Meiling Zhu
Dr. Nathan Jackson
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


Keywords

  • piezoelectric
  • MEMS
  • energy harvesting
  • bioMEMS
  • sensors, actuators and resonators

Published Papers (5 papers)

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Research

4201 KiB  
Article
Love-Mode MEMS Devices for Sensing Applications in Liquids
by Cinzia Caliendo, Smail Sait and Fouad Boubenider
Micromachines 2016, 7(1), 15; https://doi.org/10.3390/mi7010015 - 21 Jan 2016
Cited by 10 | Viewed by 4684
Abstract
Love-wave-based MEMS devices are theoretically investigated in their potential role as a promising technological platform for the development of acoustic-wave-based sensors for liquid environments. Both single- and bi-layered structures have been investigated and the velocity dispersion curves were calculated for different layer thicknesses, [...] Read more.
Love-wave-based MEMS devices are theoretically investigated in their potential role as a promising technological platform for the development of acoustic-wave-based sensors for liquid environments. Both single- and bi-layered structures have been investigated and the velocity dispersion curves were calculated for different layer thicknesses, crystallographic orientations, material types and electrical boundary conditions. High velocity materials have been investigated too, enabling device miniaturization, power consumption reduction and integration with the conditioning electronic circuits. The electroacoustic coupling coefficient dispersion curves of the first four Love modes are calculated for four dispersive coupling configurations based on a c-axis tilted ZnO layer on wz-BN substrate. The gravimetric sensitivity of four Love modes travelling at a common velocity of 9318 m/s along different layer thicknesses, and of three Love modes travelling at different velocity along a fixed ZnO layer thickness, are calculated in order to design enhanced-performance sensors. The phase velocity shift and attenuation due to the presence of a viscous liquid contacting the device surface are calculated for different thicknesses of a c-axis inclined ZnO layer onto BN half-space. Full article
(This article belongs to the Special Issue Piezoelectric MEMS)
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4193 KiB  
Article
Dynamic Electromechanical Coupling of Piezoelectric Bending Actuators
by Mostafa R. A. Nabawy and William J. Crowther
Micromachines 2016, 7(1), 12; https://doi.org/10.3390/mi7010012 - 20 Jan 2016
Cited by 21 | Viewed by 5436
Abstract
Electromechanical coupling defines the ratio of electrical and mechanical energy exchanged during a flexure cycle of a piezoelectric actuator. This paper presents an analysis of the dynamic electromechanical coupling factor (dynamic EMCF) for cantilever based piezoelectric actuators and provides for the first time [...] Read more.
Electromechanical coupling defines the ratio of electrical and mechanical energy exchanged during a flexure cycle of a piezoelectric actuator. This paper presents an analysis of the dynamic electromechanical coupling factor (dynamic EMCF) for cantilever based piezoelectric actuators and provides for the first time explicit expressions for calculation of dynamic EMCF based on arrangement of passive and active layers, layer geometry, and active and passive materials selection. Three main cantilever layer configurations are considered: unimorph, dual layer bimorph and triple layer bimorph. The actuator is modeled using standard constitutive dynamic equations that relate deflection and charge to force and voltage. A mode shape formulation is used for the cantilever dynamics that allows the generalized mass to be the actual mass at the first resonant frequency, removing the need for numerical integration in the design process. Results are presented in the form of physical insight from the model structure and also numerical evaluations of the model to provide trends in dynamic EMCF with actuator design parameters. For given material properties of the active and passive layers and given system overall damping ratio, the triple layer bimorph topology is the best in terms of theoretically achievable dynamic EMCF, followed by the dual layer bimorph. For a damping ratio of 0.035, the dynamic EMCF for an example dual layer bimorph configuration is 9% better than for a unimorph configuration. For configurations with a passive layer, the ratio of thicknesses for the passive and active layers is the primary geometric design variable. Choice of passive layer stiffness (Young’s modulus) relative to the stiffness of the material in the active layer is an important materials related design choice. For unimorph configurations, it is beneficial to use the highest stiffness possible passive material, whereas for triple layer bimorph configurations, the passive material should have a low stiffness. In all cases, increasing the transverse electromechanical coupling coefficient of the active material improves the dynamic EMCF. Full article
(This article belongs to the Special Issue Piezoelectric MEMS)
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Graphical abstract

4883 KiB  
Article
Design and Analysis of MEMS Linear Phased Array
by Guoxiang Fan, Junhong Li and Chenghao Wang
Micromachines 2016, 7(1), 8; https://doi.org/10.3390/mi7010008 - 15 Jan 2016
Cited by 3 | Viewed by 6354
Abstract
A structure of micro-electro-mechanical system (MEMS) linear phased array based on “multi-cell” element is designed to increase radiation sound pressure of transducer working in bending vibration mode at high frequency. In order to more accurately predict the resonant frequency of an element, the [...] Read more.
A structure of micro-electro-mechanical system (MEMS) linear phased array based on “multi-cell” element is designed to increase radiation sound pressure of transducer working in bending vibration mode at high frequency. In order to more accurately predict the resonant frequency of an element, the theoretical analysis of the dynamic equation of a fixed rectangular composite plate and finite element method simulation are adopted. The effects of the parameters both in the lateral and elevation direction on the three-dimensional beam directivity characteristics are comprehensively analyzed. The key parameters in the analysis include the “cell” number of element, “cell” size, “inter-cell” spacing and the number of elements, element width. The simulation results show that optimizing the linear array parameters both in the lateral and elevation direction can greatly improve the three-dimensional beam focusing for MEMS linear phased array, which is obviously different from the traditional linear array. Full article
(This article belongs to the Special Issue Piezoelectric MEMS)
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3238 KiB  
Article
Development of a Flexible Lead-Free Piezoelectric Transducer for Health Monitoring in the Space Environment
by Marco Laurenti, Denis Perrone, Alessio Verna, Candido F. Pirri and Alessandro Chiolerio
Micromachines 2015, 6(11), 1729-1744; https://doi.org/10.3390/mi6111453 - 13 Nov 2015
Cited by 27 | Viewed by 7227
Abstract
In this work we report on the fabrication process for the development of a flexible piezopolymeric transducer for health monitoring applications, based on lead-free, piezoelectric zinc oxide (ZnO) thin films. All the selected materials are compatible with the space environment and were deposited [...] Read more.
In this work we report on the fabrication process for the development of a flexible piezopolymeric transducer for health monitoring applications, based on lead-free, piezoelectric zinc oxide (ZnO) thin films. All the selected materials are compatible with the space environment and were deposited by the RF magnetron sputtering technique at room temperature, in view of preserving the total flexibility of the structures, which is an important requirement to guarantee coupling with cylindrical fuel tanks whose integrity we want to monitor. The overall transducer architecture was made of a c-axis-oriented ZnO thin film coupled to a pair of flexible Polyimide foils coated with gold (Au) electrodes. The fabrication process started with the deposition of the bottom electrode on Polyimide foils. The ZnO thin film and the top electrode were then deposited onto the Au/Polyimide substrates. Both the electrodes and ZnO layer were properly patterned by wet-chemical etching and optical lithography. The assembly of the final structure was then obtained by gluing the upper and lower Polyimide foils with an epoxy resin capable of guaranteeing low outgassing levels, as well as adequate thermal and electrical insulation of the transducers. The piezoelectric behavior of the prototypes was confirmed and evaluated by measuring the mechanical displacement induced from the application of an external voltage. Full article
(This article belongs to the Special Issue Piezoelectric MEMS)
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3007 KiB  
Article
Research on the Piezoelectric Properties of AlN Thin Films for MEMS Applications
by Meng Zhang, Jian Yang, Chaowei Si, Guowei Han, Yongmei Zhao and Jin Ning
Micromachines 2015, 6(9), 1236-1248; https://doi.org/10.3390/mi6091236 - 01 Sep 2015
Cited by 32 | Viewed by 10223
Abstract
In this paper, the piezoelectric coefficient d33 of AlN thin films for MEMS applications was studied by the piezoresponse force microscopy (PFM) measurement and finite element method (FEM) simulation. Both the sample without a top electrode and another with a top electrode [...] Read more.
In this paper, the piezoelectric coefficient d33 of AlN thin films for MEMS applications was studied by the piezoresponse force microscopy (PFM) measurement and finite element method (FEM) simulation. Both the sample without a top electrode and another with a top electrode were measured by PFM to characterize the piezoelectric property effectively. To obtain the numerical solution, an equivalent model of the PFM measurement system was established based on theoretical analysis. The simulation results for two samples revealed the effective measurement value d33-test should be smaller than the intrinsic value d33 due to the clamping effect of the substrate and non-ideal electric field distribution. Their influences to the measurement results were studied systematically. By comparing the experimental results with the simulation results, an experimental model linking the actual piezoelectric coefficient d33 with the measurement results d33-test was given under this testing configuration. A novel and effective approach was presented to eliminate the influences of substrate clamping and non-ideal electric field distribution and extract the actual value d33 of AlN thin films. Full article
(This article belongs to the Special Issue Piezoelectric MEMS)
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