Flexible Electronics Applications of Polymer Materials

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: 25 July 2024 | Viewed by 995

Special Issue Editors

Harbin Institute of Technology, Weihai, China
Interests: structural and material design; flexible intelligent electronics; multiscale analysis

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Guest Editor
School of Mechanics and Aeronautics and Astronautics, Southwest Jiaotong University, Chengdu, China
Interests: flexible electronic devices

Special Issue Information

Dear Colleagues,

Flexible electronics based on polymer materials have attracted much attention due to their unique properties and wide range of applications. These devices have the advantages of comfort, lightness, and mechanical flexibility, allowing them to be integrated into a variety of wearable and flexible electronic devices. This Special Issue will explore the latest developments, challenges, and opportunities in the field of flexible electronics made of polymer materials through high-quality works focusing on the following topics:

  • Synthesis of high-performance polymer materials;
  • Structural design of polymer materials;
  • Sensing mechanism analysis of polymer materials;
  • Polymer-derived advanced material applications;
  • Design of multi-functional flexible electronics;
  • Electro-mechanical coupling of flexible electronics.

Dr. Jian Wu
Dr. Xuebo Yuan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (1 paper)

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Research

15 pages, 49884 KiB  
Article
Design and Analysis of Porous Elastomeric Polymer Based on Electro-Mechanical Coupling Characteristics for Flexible Pressure Sensor
by Yingxuan Bu, Jian Wu, Zheming Zhang, Qiandiao Wei, Benlong Su and Youshan Wang
Polymers 2024, 16(5), 701; https://doi.org/10.3390/polym16050701 - 4 Mar 2024
Viewed by 645
Abstract
Elastomeric polymers have gained significant attention in the field of flexible electronics. The investigation of the electro-mechanical response relationship between polymer structure and flexible electronics is in increasing demand. This study investigated the factors that affect the performance of flexible capacitive pressure sensors [...] Read more.
Elastomeric polymers have gained significant attention in the field of flexible electronics. The investigation of the electro-mechanical response relationship between polymer structure and flexible electronics is in increasing demand. This study investigated the factors that affect the performance of flexible capacitive pressure sensors using the finite element method (FEM). The sensor employed a porous elastomeric polymer as the dielectric layer. The results indicate that the sensor’s performance was influenced by both the structural and material characteristics of the porous elastomeric polymer. In terms of structural characteristics, porosity was the primary factor influencing the performance of sensors. At a porosity of 76%, the sensitivity was 42 times higher than at a porosity of 1%. In terms of material properties, Young’s modulus played a crucial role in influencing the performance of the sensors. In particular, the influence on the sensor became more pronounced when Young’s modulus was less than 1 MPa. Furthermore, porous polydimethylsiloxane (PDMS) with porosities of 34%, 47%, 67%, and 72% was fabricated as the dielectric layer for the sensor using the thermal expansion microsphere method, followed by sensing capability testing. The results indicate that the sensor’s sensitivity was noticeably influenced within the high porosity range, aligning with the trend observed in the simulation. Full article
(This article belongs to the Special Issue Flexible Electronics Applications of Polymer Materials)
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