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Laser Percussion Drilling Technology
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Laser Percussion Drilling Technology

A special issue of Technologies (ISSN 2227-7080).

Deadline for manuscript submissions: closed (31 December 2015) | Viewed by 10830

Special Issue Editors

Prof. Dr. Yuan-Jen Chang

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Guest Editor
Department of Mechanical Engineering, National Yunlin University of Science and Technology, Douliou, Yunlin 64002, Taiwan
Interests: micro-/nanosystem design; micro-/nanofabrication; nonconventional machining; nanoimprint; laser micromachining
Special Issues, Collections and Topics in MDPI journals
Dr. Chao-Ching Ho

E-Mail Website
Guest Editor
Department of Mechanical Engineering, National Yunlin University of Science and Technology, 123 University Road, Section 3, Douliou, Yunlin 64002, Taiwan
Interests: machine vision; machine prognostic system; machine learning; fire smoke detection; laser ablation; 3D calibration
Prof. Dr. Jin-Chen Hsu

E-Mail Website
Guest Editor
Department of Mechanical Engineering, National Yunlin University of Science and Technology, Yunlin 64002, Taiwan
Interests: phononic crystals; acoustic metamaterial; acoustofluidic manipulation; guided waves in piezoelectric materials
Special Issues, Collections and Topics in MDPI journals
Prof. Chia-Lung Kuo

E-Mail Website
Guest Editor
Department of Mechanical Engineering, National Yunlin University of Science and Technology, Yunlin 64002, Taiwan
Interests: micro-machining; EDM; ECM

Special Issue Information

Dear Colleagues,

Laser percussion drilling, a non-contact machining process, has attracted strong interest from industry due to its wide range of industrial applications, smaller beam spot size, high operating speeds, great flexibility and accuracy, and capability to process various materials, including metals, glass, and ceramics. This Special Issue aims to highlight the state of the art in the development of laser percussion drilling and electric/magnetic/gas field-assisted laser drilling, process monitoring and characterizations of laser-material interactions. It also focuses on hybrid processes in manufacturing with laser-assisted micromachining.

Chao-Ching Ho
Yuan-Jen Chang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • laser percussion drilling
  • laser-assisted hybrid processes in manufacturing
  • laser-drilled holed depth
  • electric/magnetic/gas field-assisted laser drilling
  • process monitoring
  • plasma emission

Published Papers (2 papers)

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Research

17293 KiB  
Article
Droplet-Assisted Laser Direct Nanoscale Writing on Silicon
by Yuan-Jen Chang, Chao-Hsuan Chang, Chao-Ching Ho, Jin-Chen Hsu and Chia-Lung Kuo
Technologies 2016, 4(1), 8; https://doi.org/10.3390/technologies4010008 - 02 Mar 2016
Cited by 2 | Viewed by 4300
Abstract
Nano-structuring using laser direct writing technology has shown great potential for industrial applications. A novel application of water droplets to this technology is proposed in this paper. With a hydrophobic layer and a controlled substrate temperature, a layer of randomly distributed water droplets [...] Read more.
Nano-structuring using laser direct writing technology has shown great potential for industrial applications. A novel application of water droplets to this technology is proposed in this paper. With a hydrophobic layer and a controlled substrate temperature, a layer of randomly distributed water droplets with a high contact angle is formed on the substrate. These liquid droplets can be used as lenses to enhance the laser intensity at the bottom of the droplets. As a result, nanoscale holes can be fabricated on the substrate by controlling the laser energy density. We successfully fabricated holes with a diameter of 600 nm at a substrate temperature of 12 ∘C and a power density of 1.2 × 108 W/cm2 in our experiments. We also found that the hole diameter was around a ninth of the water droplet diameter. Meanwhile, the machined holes are not affected much by the focal length of the lens, but a hole with less than 100 nm in diameter at the center was observed. Full article
(This article belongs to the Special Issue Laser Percussion Drilling Technology)
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2057 KiB  
Article
Drilling of Copper Using a Dual-Pulse Femtosecond Laser
by Chung-Wei Cheng and Jinn-Kuen Chen
Technologies 2016, 4(1), 7; https://doi.org/10.3390/technologies4010007 - 23 Feb 2016
Cited by 8 | Viewed by 6029
Abstract
The drilling of copper using a dual-pulse femtosecond laser with wavelength of 800 nm, pulse duration of 120 fs and a variable pulse separation time (0.1–150 ps) is investigated theoretically. A one-dimensional two-temperature model with temperature-dependent material properties is considered, including dynamic optical [...] Read more.
The drilling of copper using a dual-pulse femtosecond laser with wavelength of 800 nm, pulse duration of 120 fs and a variable pulse separation time (0.1–150 ps) is investigated theoretically. A one-dimensional two-temperature model with temperature-dependent material properties is considered, including dynamic optical properties and the thermal-physical properties. Rapid phase change and phase explosion models are incorporated to simulate the material ablation process. Numerical results show that under the same total laser fluence of 4 J/cm2, a dual-pulse femtosecond laser with a pulse separation time of 30–150 ps can increase the ablation depth, compared to the single pulse. The optimum pulse separation time is 85 ps. It is also demonstrated that a dual pulse with a suitable pulse separation time for different laser fluences can enhance the ablation rate by about 1.6 times. Full article
(This article belongs to the Special Issue Laser Percussion Drilling Technology)
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